Razer, the world leader in high-performance gaming hardware, software and systems, announced that it is taking pre-orders for its new 14-inch Blade gaming laptop.

Powered by a 4th gen Intel Core i7 quad core processor with Hyper-Threading (Base 2.2 GHz/Turbo 3.2 GHz) and the latest NVIDIA GeForce GTX 765M GPU, the Blade is the thinnest and lightest 14-inch gaming laptop in history. Measuring in at just 0.66-inches thin, the Razer Blade packs more power-per-cubic-inch than any other laptop in the world. The Razer Blade utilizes solid-state storage technology with boot speeds of up to four-times faster than a traditional 5400-RPM notebook hard drive. The Razer Blade has a rigid all-aluminum chassis, with a stunning 14-inch LED-backlit HD+ display and features a custom-designed track pad and backlit gaming grade keyboard.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, today announced the arrival of its 32GB DDR3 Load-Reduced DIMM (LRDIMM) memory module. An important component of today's powerful servers, LRDIMMs use a specially designed buffer to minimize the load on the server memory bus, allowing administrators to maximize memory capacity, increase performance, and reduce the power consumption of their systems.

In standard RDIMM technology, the data bus connects directly to the multiple ranks of DRAM chips on the module, which increases electrical load and limits system speed as more modules are added. In contrast, Transcend's DDR3 Low Voltage LRDIMMs feature a full memory buffer chip on the module, which acts as a go-between for all signals sent from the host to the DRAM chips, reducing the electrical load on all interfaces. Compared to standard RDIMMs or UDIMMs, a system using Transcend LRDIMMs can support more modules per channel and higher maximum memory capacity without sacrificing speed.

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, and TE Connectivity (TE), a world leader in connectivity, announced today the availability of a Single-Sided SODIMM and a low-profile single-sided, double data rate 3 (DDR3) SODIMM connector solution to take advantage of the burgeoning market for Ultrabook devices, convertibles, tablets and other thin and light devices. Aimed at providing a reduced-height memory solution for the ultrathin computing market, the new Single-Sided SODIMM, developed by Micron, has components on either the front or back side of the module, but not both. When paired with the single-sided DDR3 SODIMM connector from TE, the total z-height of the overall solution from the motherboard is just 3mm, a 35 percent savings compared to 4.6 mm for a standard SODIMM solution.

Micron's Single-Sided SODIMM is available in a 4 GB, single-rank, x8 configuration. In addition to a reduced height, this new module is built using 30nm DDR3L-RS components that consume less power in standby compared to standard DDR3. Additionally, Single-Sided SODIMMs are pin-to-pin compatible with current DDR3 modules, making them backward compatible with existing DDR3 SODIMM connectors.

Intel's next-generation Atom processor platform, codenamed "Bay Trail" doesn't arrive before 2014, but that's not enough to stop the company from talking at great lengths about it. A new presentation intended for Intel's pals in the PC industry was leaked on German tech-forum 3DCenter.org, and reveals quite a bit more about the platform than the Bay Trail-T we already know about.

The first two slides (below) detail key scoring points of the platform over its predecessor, the "Cedar Trail." These include a true single-chip SoC (with complete integration of the chipset into the processor die), being built on the 22 nm Tri-gate transistor fab process, up to four x86-64 cores with out-of-order execution capabilities, 7th generation Intel graphics that features DirectX 11 and supports resolutions as high as 2560 x 1600 pixels, a native USB 3.0 controller, and support for DDR3L memory, that allows device makers to do away with DIMM/SO-DIMM modules to conserve board foot-print, using smaller, space-optimized DRAM chips on the main PCB.

To address the significant increase in data over the next 10-15 years, and the demand for more energy-efficient network infrastructure and servers, ARM has announced the ARM CoreLink CCN-504 cache coherent network. This advanced system intellectual property (IP) can deliver up to one terabit of usable system bandwidth per second. It will enable SoC designers to provide high-performance, cache coherent interconnect for ‘many-core’ enterprise solutions built using the ARM Cortex-A15 MPCore processor and next-generation 64-bit processors.

LSI, a leading designer of intelligent semiconductors that accelerate storage, mobile networking and client computing, and Calxeda, an innovative supplier of disruptive SoC technology for the server market, are lead licensees for the CoreLink CCN-504 launch.

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced high-volume availability of 30-nanometer (nm) reduced-power DDR3L-RS SDRAM for ultrathin computing devices and tablets. The 2-gigabit (Gb) and 4 Gb solutions reduce power consumption in standby to provide longer battery life, while maintaining the high performance and cost effectiveness of PC DRAM.

"Micron has been one of the leaders in the development and commercialization of DDR3L-RS and the introduction of its 30 nm product is confirmation of this," said Mike Howard, senior principal analyst, DRAM and Memory at IHS iSuppli. "DDR3L-RS is an excellent option for customers who have tight power budgets and need high performance at a competitive price. We expect many of the next-generation ultrathin platforms to take advantage of DDR3L-RS."

SK Hynix announced that it has introduced DDR3L-RS (Reduced Standby) DRAM for mobile solutions using its 20nm class technology. This product significantly reduces the standby power consumption.

By using cutting-edge 20nm class technology and efficiently managing standby current, this DDR3L-RS product reduces 70% of standby power compared to existing DDR3L DRAM while it maintains DDR3L performance. DDR3L DRAM which has recently gone mainstream works at 1.35V, while DDR3 DRAM does at 1.5V.

You could soon have NVIDIA Tegra 3 processors running entry-level PCs. COM (computer-on-module) and IPC (industrial PC) designer Kontron developed an NVIDIA Tegra 3 system board in the slim mini-ITX form-factor (170 mm x 170 mm), which is compatible with most ITX/ATX cases. The board has most common PC peripheral interfaces, and is fit to drive an entry-level PC. The KTT30/mITX from Kontron features an NVIDIA Tegra 3 SoC, with 4+1 ARM Cortex-A9 cores clocked at 900 MHz and GeForce ULP graphics. The GPU is fit to drive 1080p displays with H264 MPEG-4 encoding/decoding acceleration. Display outputs include HDMI 1.4a (up to 1920x1080 pixels), and LVDS 24-bit (up to 2048x1536 pixel @ 18bpp).

The Kontron KTT30/mITX packs 2 GB of DDR3L memory. For storage, it has an mSATA 3 Gb/s port, two SD card slots, and a bootable eMMC slot. Two mPCIe slots and a SIM card slot (for 3G HSDPA) handle on-board expansion. System interfaces include two RS232 (serial/COM), three USB 2.0. Apart from 3G HSDPA, the board supports gigabit Ethernet. For audio, there's 2-channel analog and multi-channel digital (S/PDIF) audio outputs. The board draws power from a 2-pin DC input. The board should be able to run most distributions of Linux for ARM (including Android and Chrome OS), and technically should also be able to run the upcoming Microsoft Windows 8 RT operating system.

Sources: Blogeee.net, FanlessTech

The Panasonic Toughbook CF-19 has transformed the way professionals work in field utilities, emergency services, defence, transport maintenance and a huge range of field services by providing access to data and applications, wherever and whenever they need it. This latest device will mark a decade for the product line of market-leading rugged convertible notebooks, enabling customers to benefit from the latest design and technology enhancements whilst continuing to use the wide range of peripherals built around the range, such as docking stations and car mounts.

The new Toughbook CF-19 includes the 3rd generation Intel Core i5 Processor & Chipset. The high performance Intel Core i5-3320 vPro (2.60 GHz, up to 3.30 GHz with Intel Turbo Boost Technology) standard voltage processor with Intel HD 4000 graphics, ensures the device is capable of handling the most intensive applications. To ensure reliability in the most challenging environments, the CF-19 remains unique in the market with its fan less design; instead using Panasonic energy optimisation and optimised heat pipes to cool the full performance, standard voltage CPU.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launched a new line of DDR3L ECC SO-DIMM server memory modules, boasting low voltage, large densities, and rapid processing capability. They are designed and engineered especially for cloud computing solutions, and can greatly minimize the power consumption of a wide range of network systems.

A new kind of server is becoming increasingly needed for website hosting and mission critical applications. Micro-servers are a new type of server suited for the special workloads of data centers. Starting in the second half of 2009, many large data centers and information service suppliers have begun to use micro-servers. Micro-servers are taking an increasingly important role in small site dedicated hosting, lightweight web serving, and simple content delivery. Many semiconductor manufacturers have announced plans to enter the micro-server market, and are expected to release new low-power processors for use with high density servers.

Transcend Information, Inc. (Transcend), a worldwide leader in storage and multimedia products, is proud to announce its launch of 16 GB DDR3-1600 Registered DIMM (RDIMM) and 8GB DDR3L-1333 Low Voltage RDIMM modules. Fully compatible with the latest generation of Intel Xeon and Core i7 processors, the cost-effective DDR3 memory modules provide increased memory density and higher performance, while significantly reducing power consumption.

As Transcend's highest density DDR3 module, the 16GB DDR3-1600 RDIMM is constructed with top quality 4 Gb DDR3 1 Gbx4 35nm DRAM chips that deliver stable performance and durability. A single 16 GB memory module can lower power consumption by a staggering 75% compared with using four 4 GB modules, thereby saving energy and costs. The 16GB DDR3 module is rated at 1600 MHz with low latency of 11-11-11-28 and an operating voltage of a mere 1.5V. Offering memory bandwidth up to 12.8 GB/s and the flexibility to expand maximum capacity to 96 GB (per processor), the 16GB DDR3-1600 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.

As soon as Intel rolls out its Ivy Bridge mobile processors ASUS' ultrabook offering will be updated through the release of two Zenbooks, the 11.6-inch UX21A and the 13.3-inch UX31A. Design-wise, these upcoming models are expected to resemble their predecessors (the UX21 and UX31) but they'll feature more juicy specs like (optional) Full HD IPS screens (the UX21A will have a 1366 x 768 display by default, whereas the 'base' UX31A comes with a 1600 x 900 panel), and one of three Ivy Bridge CPUs - the 1.8 GHz Core i3-3217U, 2.4 GHz Core i5-3317U or 2.8 GHz Core i7-3517U, with a 17 W TDP.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, announced its latest product offering aimed at satisfying the needs of extreme gamers. In an industry first, the company has launched the single 8GB XPG Gaming Series DDR3L 1333G Desktop overclocking memory. With a high density of 8GB and low voltage of only 1.35V, it is anticipated to provide excellent system performance and overclocking capabilities to meet the requirements of power users and overclockers.

ADATA DRAM product planning department project manager Alex Wu explained, “With the popularity of 64-bit operating systems, high-density memory is a prerequisite in many gamers’ minds. We are the first to launch DDR3L 1333G high-density 8GB memory modules, achieved in the XPG Gaming Series”. He further stated: “This product adopts a 1.35 volt design, to offer gamers excellent stability and efficiency and also reduce waste heat and power consumption costs”. The XPG Gaming Series DDR3L 1333G desktop overclocking memory features high density and low voltage, helping gamers achieve the ultimate in system effectiveness. At the same time, the reduced power consumption leads to lower carbon emissions, resulting in greater environmental sustainability.

ADATA Technology, a worldwide leading manufacturer in high-performance DRAM modules and NAND Flash application products, today introduced its latest XPG Series DDR3L 1333MHz 4GB dual-channel kit memory. The modules feature high-density, low timing and low voltage, enhanced system stability, and improved performance to meet market needs and especially those of gamers.

The latest XPG Plus series DDR3L 1333+ is available in 2GB single channel and 4GB dual channel kits, with latency of 8-8-8-24. The utilization of an exclusively designed aluminum heat sink and high quality circuit board ensures high efficiency and stability of the memory modules. The Gaming Series DDRL 1333G 4GB dual channel kit has latency of 9-9-9-24. They employ the same special heat sink design, and can effectively reduce running temperature to extend the life of the module.

One of AMD's design goals for its Fusion architecture must have been its application in mobile processors, where AMD isn't the brightest in terms of energy efficiency. The company's fastest product for the notebook platform is based on the Llano silicon, will release in 2011, and is a quad-core APU. Enter the AMD A8-3530MX.

Built on the 32 nm process with FS1 package, the A8-3530MX is an accelerated processing unit (APU), it combines a quad-core processor with a powerful GPU and northbridge component. With a default clock speed of 1.90 GHz and TurboCore speed of 2.60 GHz, the A8-3530MX packs 4 MB of L2 cache, and a dual-channel DDR3-1600 MHz memory controller, that also supports DDR3L-1333 MHz.

The GPU component is the DirectX 11 compliant AMD Radeon HD 6620G, with 400 stream processors, and engine clock speed of 444 MHz. To drive it, the northbridge component is entirely integrated into the APU, which packs a PCI-Express 2.0 hub to support discrete graphics. Despite so much machinery, the top-of-the-line chip maintains a TDP of 45W (common for notebook quad-core chips).

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced it had developed a 2-gigabit DDR3 SDRAM using an industry-leading 25nm process for memory manufacturing. Using the most advanced process technology available Elpida has achieved the industry's smallest chip size for a 2-gigabit SDRAM.

The newly developed 25nm DRAM process technology requires 30% less cell area per bit compared with Elpida's 30nm process. The chip output for a 2-gigabit DDR3 SDRAM wafer using the new process is about 30% higher versus 30nm.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had begun sample shipments of its new 2-gigabit DDR3 SDRAM (product names: EDJ2116DEBG and EDJ2108DEBG) geared for use in consumer electrical appliances. The new SDRAM is the industry's smallest 2-gigabit DDR3 that supports an x16-bit I/O interface.

The new 2-gigabit DDR3 SDRAM is well suited to consumer electrical appliances. It meets the high-speed DDR3-1600 (1600Mbps) standard likely to become the mainstream memory speed standard in 2011, uses energy-efficient 1.35V for the DDR3L-1333 memory speed and is compliant with DDR3-Plus (seamless BL4 access) for upgrading the performance of consumer electrical appliances.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had completed development of a 30nm process 2-gigabit DDR3 SDRAM. The new 2-gigabit DDR3 SDRAM used 30nm-level advanced process migration technology to create the DRAM industry's smallest-level 2-gigabit DDR3 SDRAM. It achieves 45% more chips per wafer compared with Elpida's 40nm process products. Also, the new process design developed by Elpida will help contain rising chip costs associated with process migration. As a result, the 2-gigabit DDR3 is slated to become an extremely cost-competitive product.

Elpida's new chip meets the JEDEC specs for the high-speed DDR3-1866 and 1.35V low-voltage, high-speed DDR3L-1600 memory chips, both expected to become mainstream industry products in 2011. Also, the 30nm DDR3 SDRAM is eco-friendly. As a DDR3 SDRAM it achieves one of the industry's lowest levels of electric current usage (approximately 15% less operating and approximately 10% less standby usage compared with Elpida's 40nm products), which contributes to lower PC and digital consumer electronics power consumption.

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, unveils new Ultra-Low Voltage (ULV) and Extreme-Low Voltage (ELV) high-speed DDR3 desktop memory, providing the optimal balance of performance and power efficiency in one solution. Committed to staying ahead of the curve, OCZ is offering enthusiast-grade memory that complies with the latest JEDEC "DDR3L" low-voltage standards which ensures that system RAM runs cooler and more efficiently during intensive multi-tasking, gaming, and productivity applications.

"We are pleased to announce a complete range of low-voltage memory offerings designed for the latest crop of energy efficient platforms," said Eugene Chang, Vice President of Product Management. "In the past, lower voltage meant lower performance, but now with our extreme-low voltage optimized memory, consumers don't have to sacrifice high performance to also achieve energy savings."

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JEDEC DDR3L, a widely anticipated addendum to its JESD79-3 DDR3 Memory Device Standard. Continuing the evolution of DDR3 as the dominant DRAM standard today, DDR3L will enable a significant reduction in power consumption for a broad range of products that utilize memory; including laptops, desktops, servers, networking systems and a wide array of consumer electronics products. The updated version of JESD79-3, including the DDR3L addendum, is available for free download here.

Called DDR3L for DDR3 Low Voltage, devices adhering to the new standard will operate from a single 1.35V power supply voltage compared to 1.5V in existing devices. Under the new standard, DDR3L memory devices will be functionally compatible to DDR3 memory devices, but not all devices will be interoperable at both voltage ranges.

A-DATA Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today announced its DDR3L (“L” for low voltage) 1066/1333 (1.35volt) MHz Registered DIMM and DDR3L 1066/1333 MHz (1.35volt) ECC DIMM low voltage server memories have been certified by Intel, that able to perform lower power consumption with great reliability to increase better efficiency on Westmere-EP processor-based server.

“Enterprise often requires 24x7 operations from server memory for data accessing and collecting with reliability and performance requirements,” said Richard Shen, manager of A-DATA product management department. “We are proud to offer our DDR3L 1066/1333 MHz R-DIMM and DDR3L 1066/1333 MHz ECC DIMM low voltage server memory that has certified by Intel to enterprise customers, which delivers high performance and great reliability with less power consumption to meet enterprise’s critical requirements, as well as to protect and to preserve the environment.”

Lexar Media, a leading global provider of memory products for digital media, today introduced Crucial DDR3L-1333Mhz 1.35v energy-efficient server memory modules in support of the new Intel Xeon processor 5600 series. Available in 1GB, 2GB and 4GB RDIMM and VLP (very low profile) RDIMM modules, Crucial DDR3L memory modules are fully compatible and have been validated with the new Intel Xeon processor 5600 series. Servers across the enterprise, including those utilized for virtualization, data storage and processing, and blade servers will reap the benefits of new Crucial DDR3L memory. Crucial DDR3L memory is available through select resellers worldwide and online at Crucial.com/server.

"The benefits of energy-efficient DDR3L memory are clear – most notably the significant reduction in memory sub-system energy consumption and overall system cooling demands. Moreover, these benefits come without sacrificing the performance gains our customers expect from Intel's next-generation servers," said Jim Jardine, Lexar Media senior worldwide product manager. "Additionally, all Crucial DDR3L 1.35v memory has been fully validated and certified compatible with the Intel Xeon Processor 5600 series, so customers can rest assured their server infrastructure investment will perform reliably and efficiently with Intel's newest processors."