News Posts matching "JEDEC"

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How Intel Plans to Transition Between DDR3 and DDR4 for the Mainstream

The transition between DDR2 and DDR3 system memory types was slower than the one between DDR and DDR2. DDR3 made its mainstream debut with Intel's X38 and P35 Express platforms, at a time when the memory controller was still within the domain of a motherboard chipset, at least in Intel's case. The P35 supported both DDR2 and DDR3 memory types, and motherboard manufacturers made high-end products based on each of the two memory types, with some even supporting both.

Higher module prices posed a real, and higher latencies, posed a less real set of drawbacks to the initial adoption of DDR3. Those, coupled with the limited system bus bandwidth, to take advantage of DDR3. DDR3 only really took off with Nehalem, Intel's first processor with an integrated memory controller (IMC). An IMC, again in Intel's case, meant that the CPU came with memory I/O pins, and could only support one memory type - DDR3. Since then, DDR3 proliferated to the mainstream. Will the story repeat itself during the transition between DDR3 and the new DDR4 memory introduced alongside Intel's Core i7 "Haswell-E" HEDT platform? Not exactly.

Century Micro Unveils Entry-level DDR4 ECC Registered Memory Modules

Japanese memory maker Century Micro announced its entry-level DDR4 ECC registered memory modules. Compatible with Intel Xeon E5-2600 v3 and Core i7-5000 HEDT processors, the modules come in density of 8 GB (model: CD8G-D4RE2133L82), making up single-module and four-module (32 GB) kits. The CD8G-D4RE2133L82 complies with JEDEC specifications, and runs at DDR4-2133 MHz speeds, with a module voltage of 1.2V, and timings of 15-15-15. The module features an 8-layer PCB, and appears to use DRAM chips made by SK Hynix. The modules will start selling in a couple of weeks from now.

JEDEC Publishes Wide IO 2 Mobile DRAM Standard

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD229-2 Wide I/O 2. Wide I/O 2 offers a significant speed increase over Wide I/O, while retaining Wide I/O's vertically stacked through silicon via (TSV) architecture and optimized packaging. Combined, these characteristics position Wide I/O 2 to deliver the ever-increasing speed, capacity, and power efficiency demanded by mobile devices such as smartphones, tablets and handheld gaming consoles. JESD229-2 may be downloaded free of charge from the JEDEC website here.

Wide I/O 2 provides four times the memory bandwidth (up to 68GBps) of the previous version of the standard, but at lower power consumption (better bandwidth/Watt) with the change to 1.1V supply voltage. From a packaging standpoint, the Wide I/O 2 die is optimized to stack on top of a system on chip (SOC) to minimize power consumption and footprint.

JEDEC Releases LPDDR4 Standard for Low Power Memory Devices

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-4 Low Power Double Data Rate 4 (LPDDR4). Designed to significantly boost memory speed and efficiency for mobile computing devices such as smartphones, tablets, and ultra-thin notebooks, LPDDR4 will eventually operate at an I/O rate of 4266 MT/s, twice that of LPDDR3.

The new interface promises to have an enormous impact on the performance and capabilities of next-generation portable electronics. "LPDDR4 represents a dramatic performance increase," said Mian Quddus, Chairman, JEDEC Board of Directors. "It is intended to meet the power, bandwidth, packaging, cost and compatibility requirements of the world's most advanced mobile systems." Developed by JEDEC's JC-42.6 Subcommittee for Low Power Memories, the JESD209-4 LPDDR4 standard can be downloaded from the JEDEC website for free by clicking here.

ADATA Premier DDR4 Memory Modules Spotted in Stores

Wanna build a Haswell-E HEDT build on the "cheap?" Then this could make it to your list. ADATA is ready with its no-frills Premier line of DDR4 memory modules, which are sold in single-module packs of 4 GB and 8 GB. The modules stick to JEDEC specifications of DDR4-2133 MHz (PC4-17000), with CAS latencies of 15T, and voltage of 1.2 Volt. The modules use DRAM chips made by SK Hynix. Inclusive of all taxes, the 4 GB module is priced at the equivalent of $75 USD in Japan; and the 8 GB module goes for the equivalent of $150.


Source: Akiba PC Watch

Apacer Launches Mini Wide-temperature SSD

Resistance to shock, low noise and low power consumption - these are the superior physical properties of SSDs, which have become essential for satisfying the storage requirements of industrial computers. The application scope of SSDs on industrial computers has also expanded due to increasingly harsh market demands and advancing process technologies.

With the increasing prevalence of the concept of security, Unmanned Aerial Vehicles (UAVs) have gradually been used for the purpose of national defense and monitoring. It will be further developed in commercial applications, such as oil pipe monitoring, environment observation, aviation, communication transmission and other commercial applications. The importance of stability of a storage device is thus in top priority with such an exciting prospect.

SMART Modular Announces DDR4 NVDIMMs with SafeStor Technology

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, has announced today the introduction of its next generation DDR4 NVDIMMs. Offering non-volatile memory functionality while utilizing the latest DDR4 DRAM technology, this memory solution is designed to improve application performance and data integrity in server environments.

Unique to these new DDR4-2133 NVDIMMs is SMART's proprietary SafeStor technology, the engine which initiates backup and restore operations upon command from the host controller. The NVDIMM modules also support multiple command delivery options to trigger SafeStor backup during a host-detected power outage and recovery events. The SafeStor engine employs multi-channel fast NAND and high-speed switching circuitry to provide robust backup and restore capability, all while functioning as a JEDEC standard DDR4 RDIMM during normal operation. Temporary power is provided to the NVDIMM during a power loss by a hybrid supercap module, which can be tailored to individual application environments. The new NVDIMMs also feature an end-to-end error checking and correction capability to ensure a high level of data integrity during backup and restore operations.

ADATA DDR4 OC Module Spotted on a Working Haswell-E HEDT System

ADATA's claim of being the first memory maker with DDR4 overclocking modules wouldn't fly with anyone, if they weren't using a live Haswell-E HEDT platform to show it off. The system appears to be using a prototype Intel X99 chipset micro-ATX motherboard by ASRock, and a Haswell-E engineering sample. The module comes with JEDEC SPD profile of 2133 MHz, but claims to offer tons of overclocking headroom. The system was wired to a display, and evidently, CPU-Z can't read the memory config. It can, however, read out DRAM clock and timings. The system was doing 1373 MHz (2746 MHz DDR), with timings of 14-14-14-36-CR2T.

Panram Unveils Ninja-V DDR4 Memory Modules

Panram unveiled its first consumer DDR4 memory modules, ready for upcoming Haswell-E HEDT platform, the Ninja-V. Equipped with simple and contemporary looking heatspreaders that aren't much taller than the module itself, the first Ninja-V modules will stick to JEDEC standard speeds of DDR4-2133. They'll run at 2133 MHz, with standard timings, and module voltage of 1.2V. The company will launch the Ninja-V towards the end of this year, when Intel launches the Haswell-E HEDT platform, which features a quad-channel DDR4 IMC, which could offer system memory bandwidths in excess of 80 GB/s.

ADATA's Next-generation XPG Memory Modules Detailed

Here is the first picture of ADATA's XPG V3 DDR3 DRAM module. It will be launched alongside the company's first enthusiast-grade DDR4 modules. ADATA's XPG Z1 DDR4 modules will come in densities as high as 16 GB, clocked at JEDEC-standard DDR4-2133 MHz, and run at module voltages of 1.2V. The same heatspreader design as the one pictured below, will also be used on the company's new XPG V3 line of DDR3 modules, and will come in a number of color options, to match your motherboard's color scheme. The first client platforms with support for DDR4 memory include Intel "Broadwell," and "Haswell-E" HEDT.

Team Group Announces mSATA MP1 SSD

Team Group, the global leading brand of memory storage launched on a brand new mSATA MP1 with only 1/8 size of general 2.5" SSD, which can meet JEDEC mSATA size specification. Focused on the lightest and thinnest volume and outstanding performance, it becomes perfect collocation of Notebook, Ultrabook, Tablet PC and NUC, etc.

Even though a small mechanism, mSATA MP1 SSD combines all the advantages of SSD in one- high speed, low power consumption, high stability and zero noise. mSATA MP1 supports SATA III, having 6Gb/s transmission rate, reading speed up to 530 MB/sec and writing speed up to 440 MB/sec. Compared with traditional mechanic HDD, it sharply decreases the time to wait for boot up, running program and windows operating and effectively increases operation efficiency. Meanwhile, parts of Ultrabook and PC/Notebook are either changed to built-in small capacity mSATA or installed with mSATA slot to respond market trend of pursuing light mobile device. Consumers have choice to purchase mSATA MP1 as system boot disk or go with HDD, which is used for disk cache to strengthen traditional disk performance. To compare with traditional HDD, mSATA MP1 can save you about 2 times boot operation time and significantly boost overall computer performance.

JEDEC Publishes Release 6 of the DDR3 SPD Standard

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of Release 6 of the DDR3 Serial Presence Detect (SPD) document. The updated standard, SPD4_01_02_11: SPD Annex K - Serial Presence Detect (SPD) for DDR3 SDRAM Modules (Release 6), describes new memory timing parameters and enables higher capacity memory modules, and may be downloaded free of charge from the JEDEC website.

"The DDR3 memory module market is in its full stride, with new applications pushing the technology into an ever-widening array of offerings, and the Serial Presence Detect is a reliable and consistent way to document the features of these new modules so that system software can tune system performance," said Mian Quddus, Chairman of JEDEC's JC-45 Committee for Dynamic Random Access Memory (DRAM) Modules. He added, "This release of the DDR3 SPD standard adds support for memory modules with up to 8 ranks of DDR3 SDRAMs, enabling 64GB per slot using mainstream 4Gb memory chips."

Samsung Develops Industry's First 8 Gb LPDDR4 Mobile DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has developed the industry's first eight gigabit (Gb), low power double data rate 4 (LPDDR4), mobile DRAM.

"This next-generation LPDDR4 DRAM will contribute significantly to faster growth of the global mobile DRAM market, which will soon comprise the largest share of the entire DRAM market," said Young-Hyun Jun, executive vice president, memory sales & marketing, Samsung Electronics. "We will continue introducing the most advanced mobile DRAM one step ahead of the rest of the industry so that global OEMs can launch innovative mobile devices with exceptional user convenience in the timeliest manner."

Samsung's new high-speed 8Gb LPDDR4 mobile DRAM will provide the highest level of density, performance and energy efficiency for mobile memory applications, enabling end users to have faster, more responsive applications, more advanced features, and higher resolution displays while maximizing battery life.

G.Skill Announces AEGIS Performance System Memory

G.Skill announced the AEGIS line of high-performance, standard-height DDR3 memory modules, for gaming PC builds. The modules are available with JEDEC-approved SPD profiles of DDR3-1333 MHz, and DDR3-1600 MHz; and in densities of up to 8 GB. The modules could make up solo and dual-channel kits. The modules are designed to run at DDR3-1333 at voltages of 1.35V, and rather timings of 9-9-9-24; and DDR3-1600 at 1.50V, and rather loose timings of 11-11-11-28. The modules feature black PCBs with heatspreaders that are basically sheets of aluminium, with die-cast prints on them. The modules are backed by lifetime warranties, G.Skill didn't announce pricing.

Team Group ZEUS Overclocking DDR3 Memory Modules Now Available

Zeus in ancient Greek mythology went against his father and unfair principles in his world. After ten years of war, he finally was able to take over the power and introduced to people political freedm and justice in agreements. Today, well known memory manufacturer - Team Group also decided to fight against the rules in our actual world by intoducing ZEUS Overclocking memory series. Normally it has 1600 MHz speed, but model is totally made for overclocking the systems to the maximum limits.

Memory "bones" works normally with voltage from 1.45V to 1.5V, which means it will be totally easy to tweak them into bigger speed with a little higher voltage. All pieces were hand picked and tested at the factory before entering the sales. Total height of Zeus memory is 3 cm, so they are fully suitable for any highend computers with popular lately gigantic CPU coolers.

JEDEC Publishes Universal Flash Storage (UFS) Standard v2.0

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of Universal Flash Storage (UFS) version 2.0. Developed for mobile applications and computing systems requiring high performance and low power consumption, the new UFS v2.0 standard offers increased link bandwidth for performance improvement, a security features extension as well as additional power saving features over the prior version. JESD220B Universal Flash Storage v2.0 may be downloaded free of charge from the JEDEC website: http://www.jedec.org/standards-documents/results/jesd220b

UFS is a high performance interface designed for use in computing and mobile systems requiring low power consumption such as smart phones and tablets. Its high speed serial interface and optimized protocol enable significant improvements in throughput and system performance.

Avexir Announces Core Gold Series Memory

In every Avexir office, there is hanging motto - "What we believe is how we behave". That is the mission and a way Avexir always wanted to act, so we could see that the manufacturer policy is in some points totally different from other memory brands. For example in Avexir factory after producing, each piece is tested on several computers and it goes to packaging and sales only if it fully pass the JEDEC tests. With this brand you know what you are buying.

Thanks to its quality policy Avexir is known as producer of high quality RAM, especially for those who like to overclock their systems. Today European market gets new model named Avexir Core GOLD with yellow LEDs. Memory serie supports Intel XMP 1.3 technology, which allows to overclock computer to the maximum and squeeze as much performance from PC as possible and not be satisfied only with factory defaults.

Greenliant Introduces Industrial Grade mSATA ArmourDrive SSD

Greenliant Systems, a leader in energy-efficient, highly secure and reliable solid state storage products, has entered the removable solid state drive (SSD) market and is sampling its new mSATA ArmourDrive GLS86 product line. Based on SATA NANDrive, using Greenliant's internally developed NAND controller, mSATA ArmourDrive is designed for applications that require industrial temperature capability, high reliability and long-life data storage.

mSATA ArmourDrive operates at extreme temperatures between -40 to +85 degrees Celsius with 1-bit-per-cell (SLC) or 2-bits-per-cell (MLC) NAND flash memory, which gives customers a dependable, industrial temperature mSATA SSD using cost-effective MLC NAND. Addressing the needs of space-constrained embedded systems, mSATA ArmourDrive measures 29.85mm x 50.80mm x 4.80mm (JEDEC MO-300).

Innodisk Releases World's First Industrial-Embedded SATA µSSD - nanoSSD

Innodisk, a designer and manufacturer of SSDs for commercial and industrial applications, announces a release of the industrial-embedded industry's first SATA device in accordance to SATA µSSD standards - nanoSSD.

Through the integration of a control chip, flash memory and peripheral power components into a single ball grid array (BGA) package, Innodisk has managed to reduce the size of the nanoSSD to approximately 1% the size of a 2.5" SSD. With dimensions of only 16 x 20 x 2 mm (WxLxH), a weight of only 1.5g, SATA III support, capacities ranging from 4 to 64 GB and both x86 and ARM compatibility, nanoSSD can be incorporated into a wide variety of applications where a small form-factor and high transfer rates are important, including industrial mobile devices, embedded systems, tablets, high-end smart phones and Ultrabooks.

Innodisk Releases DDR4 RDIMM Samples to Server Market

Innodisk is proud to be among the first to supply (DDR4) registered DIMM product samples to key server companies for their next-generation systems. With this announcement, Innodisk, an industry leader in DRAM modules for industrial applications and embedded systems, will continue to offer the most advanced technology to its customers. The result of almost eight years of development, DDR4 (Double Data Rate 4) technology improves on the previous generation, DDR3, in every way. These new memory products provide users with greater performance, but can still cut costs by saving power and space, and reducing waste heat.

DDR4 offers a giant leap in peak performance over DDR3 technology, with a 3.2 Gbps data transfer rate. In fact, DDR4 could eventually even surpass this already high rate, according to standards organization JEDEC, in the same way that DDR3 surpassed its initial ceiling of 1.6 Gbps. DDR4 memory bus speeds start at 2133MHz, which already offers a huge jump in potential performance from the average bus speed of 1333MHz and 1666MHz offered by DDR3.

AMD Working On Stripped-Down PlayStation 4 SoC for PCs

Ahead of its unveiling last week, it was expected that Sony's PlayStation 4 console would be driven by little more than an AMD A-Series "Trinity" APU. It ended up being a lot more than that. The custom-design SoC that drives the next-generation console is a joint effort between AMD and Sony, which integrates an 8-core x86-64 CPU based on the company's new "Jaguar" micro-architecture; a GPU based on its Graphics CoreNext technology; a GDDR5 integrated memory controller, and certain enhancements by Sony. In an interview with The Inquirer, the company hinted that it's interested in porting the SoC over to the PC platform, minus Sony's share of the development.

Toshiba Ships Samples of Industry's First Universal Flash Storage Devices

Toshiba Corporation and Toshiba America Electronic Components, Inc., a committed leader that collaborates with technology companies to create breakthrough designs, today announced that it began shipping samples of its 64-gigabyte (GB) embedded NAND flash memory module equipped with a Universal Flash Storage (UFS) interface. The first in the industry, the new module is fully compliant with the JEDEC UFS Ver.1.1 standard, and is designed for a wide range of digital consumer products - including smartphones and tablet PCs.

With improved data processing speeds in host chipsets and wider bandwidths for wireless connectivity, demand continues to grow for large density, high-performance memory that supports high resolution video. A proven innovator in this key area, Toshiba is reinforcing its leadership role by being the first in the industry to ship samples with a 64GB UFS module.

Micron Technology Samples New Single-Sided DDR3 DRAM Module

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, and TE Connectivity (TE), a world leader in connectivity, announced today the availability of a Single-Sided SODIMM and a low-profile single-sided, double data rate 3 (DDR3) SODIMM connector solution to take advantage of the burgeoning market for Ultrabook devices, convertibles, tablets and other thin and light devices. Aimed at providing a reduced-height memory solution for the ultrathin computing market, the new Single-Sided SODIMM, developed by Micron, has components on either the front or back side of the module, but not both. When paired with the single-sided DDR3 SODIMM connector from TE, the total z-height of the overall solution from the motherboard is just 3mm, a 35 percent savings compared to 4.6 mm for a standard SODIMM solution.

Micron's Single-Sided SODIMM is available in a 4 GB, single-rank, x8 configuration. In addition to a reduced height, this new module is built using 30nm DDR3L-RS components that consume less power in standby compared to standard DDR3. Additionally, Single-Sided SODIMMs are pin-to-pin compatible with current DDR3 modules, making them backward compatible with existing DDR3 SODIMM connectors.

Super Talent Announces Green Very Low Profile (VLP) Memory

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, introduces its updated green memory modules.
With no tradeoffs in price or performance, choosing VLP DIMMs for computing can have an enormous environmental impact when the hundreds of thousands of memory modules produced monthly are taken into account.

"Decreasing overhead in a data center is an easy way for a company to reduce costs. With Super Talent's Green Memory, power and cooling costs can be easily cut while maintaining speed and reliability for a company," said Shimon, VP of Engineering, Super Talent Technology.

Micron Extends Portfolio of Phase Change Memory for Mobile Devices

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced the addition of a new product to its Phase Change Memory (PCM) portfolio. With high-volume shipments of its 45-nanometer (nm), 1-gigabit (Gb) PCM-based multichip package (MCP) solution for mobile devices well underway, the company is now sampling a 512-megabit (Mb) PCM plus 512Mb LPDDR2 MCP that offers greater flexibility in terms of application requirements. The company also announced that it has been shipping 1Gb PCM to one of the world's leading mobile device manufacturers, Nokia, for use in their recently announced phones.

As the first company in the world to ship PCM solutions in volume, Micron is building on its close cooperation with chipset vendors, enablers and handset manufacturers to meet growing market demand for PCM. Nokia is using Micron's PCM solution to enrich the functionality of select devices in its portfolio.
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