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Micron and Intel Unveil New 3D NAND Flash Memory

Micron Technology, Inc., and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Samsung Introduces 128GB 3-bit NAND Flash Memory Storage Device

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced a high-performance mobile memory storage based on Embedded MultiMediaCard (eMMC) 5.0 technology. The new 128-gigabyte (GB), 3-bit NAND-based eMMC 5.0 storage is targeted at the smartphone and tablet mass markets.

"With the introduction of our value-focused, 3-bit NAND-based eMMC 5.0 line-up, we expect to take the lead in the expansion of high-density mobile storage," said Dr. Jung-Bae Lee, Senior Vice President of Memory Product Planning and Application Engineering Team, Samsung Electronics. "We are continuing to enhance our next-generation embedded mobile memory offerings with improved performance and higher densities to meet increasing customer demand across the mobile industry."

New Micron "Ultra" Memory Products Enable Next-Generation Automotive Systems

Micron Technology, Inc., today announced the availability of ultra reliable, ultra high-speed and ultra high-temperature parallel NOR Flash and low-power DDR4 (LPDDR4) DRAM to meet the increasing memory requirements for the automotive market segment. Micron's G18 NOR family offers the industry's highest-performance parallel NOR, while Micron's automotive-grade LPDDR4 solutions are an industry-first.

These new products meet the needs of automotive applications that require ultra high speed. The G18 family's high performance (266 MB/s)enables faster boot and code execution for higher-density applications, while LPDDR4 enables 33 percent higher peak bandwidth than DDR4. Additionally, Micron's new solutions deliver long-lasting reliability and meet ISO/TS certification requirements-with the G18 family enabling three times faster throughput over quad SPI NOR, and the LPDDR4 products undergoing additional package-level burn-in testing. Furthermore, Micron's G18 NOR products have options that meet the industrial temperature (IT) range of -40 to 85°C and the automotive-grade automotive temperature (AAT) range of -40 to 105°C. The LPDDR4 products have options that meet the automotive-grade industrial temperature (AIT) range of -40 to 95°C, as well as some future options that will meet the automotive-grade ultra temperature (AUT) range of -40C to 125°C, which is the highest operating temperature range in the industry, expected to be available in 2016.

Inno3D Announces iChill GeForce GTX 980 and GTX 970

Inno3D iChill GeForce GTX 980 and GTX 970 Black Series Accelero Hybrid S is an integrated air and liquid solution in the after-market. It offers an all-in-one solution with 200% cooling performance and 9 times quieter than the stock cooler. It is also the first LCS to have an integrated active fan specifically designed to cool RAM and VR. Furthermore, it is simple to use, maintenance-free and excellent value for money.

Traditionally GPU liquid cooling is expensive and complicated and adopted by only the most technical audience, the GPU however is now one of the most power hungry and hottest components you'll find in a high-end PC and will benefit from the iChill liquid cooling system even more than CPUs.

Avexir Unveils RAIDEN Series High-end DDR3 Memory with Lightning Tubes

Boutique memory modules designer Avexir unveiled its flagship DDR3 memory module, the RAIDEN. This double-height module features a plasma tube on its top, which lights up with a blue lightning-effect, which could look awesome in cyberpunk case-mods. The module could pair particularly well with ASUS Z97 Sabertooth Mark S, ASUS X99 series, and MSI Krait series motherboards.

Form aside, the module has some pretty formidable specs - an 8-layer main PCB, XMP profiles of up to DDR3-2400 MHz, a machined aluminium heatsink drawing heat away from the DRAM chips, and hand-binned DRAM chips for the best overclocked performance. The RAIDEN comes in speeds of DDR3-1866 and DDR3-2400, densities of 4 GB and 8 GB, and in dual- and quad-channel kits that are combinations of the two top-level specs. Avexir didn't reveal pricing or availability.

HyperX Releases FURY DDR4 Memory; Adds High-capacity Predator DDR4 Kits

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced HyperX FURY DDR4 memory. HyperX FURY DDR4 is the first product line to offer automatic overclocking via plug-and-play functionality for the next generation of high-end desktops featuring the Intel X99 chipset and Haswell-E processors. HyperX FURY DDR4 is available in 2133MHz, 2400MHz and 2666MHz frequencies, and in various kits configurations from 8GB to 64GB.

HyperX FURY DDR4 memory is a cost-efficient high-performance upgrade for Intel 6- and 8-core processors and helps to provide faster video editing, 3D rendering, gaming and AI processing. It takes full advantage of the power efficiency of DDR4 with low 1.2V settings. HyperX FURY DDR4 features a low profile heat spreader in the signature FURY asymmetrical design with black PCB to stand out and complement the latest PC hardware designs.

SanDisk Unveils the World's Highest Capacity microSD Card

SanDisk Corporation, a global leader in flash storage solutions, today introduced the 200GB SanDisk Ultra microSDXC UHS-I card, Premium Edition, the world's highest capacity microSD card for use in mobile devices. In just one year after introducing its record-breaking 128GB SanDisk Ultra microSDXC card, SanDisk has increased storage capacity by 56% within the same fingernail-sized form factor. Keeping up with the demands of today's mobile users, the new card provides the freedom to capture, save and share photos, videos and other files without worrying about storage limitations.

"Mobile devices are completely changing the game. Seven out of 10 images captured by consumers are now from smartphones and tablets. Consumers view mobile-first devices as their primary means for image capture and sharing, and by 2019 smartphones and tablets will account for nine out of 10 images captured," said Christopher Chute, Vice President, Worldwide Digital Imaging Practice, IDC. "As the needs of mobile users continue to change, SanDisk is on the forefront of delivering solutions for these demands as is clearly illustrated through their growing portfolio of innovative products, including the new 200GB SanDisk Ultra microSDXC card."

SanDisk Intros Two Smartphone-friendly Flash Drives

SanDisk Corporation, a global leader in flash storage solutions, today introduced two new, innovative mobile memory solutions that help consumers manage and transfer content captured on their favorite devices. The company's first Dual USB Drive with Type C connector, ideal for Type C-ready connected devices, and the 128GB iXpand Flash Drive, designed for iPhone and iPad, both enable consumers to quickly and easily transfer content directly from a mobile device to a Mac or PC computer.

According to a recent industry report from IDC, this year people will capture and share an estimated 1.6 trillion images, and seven out of 10 of those images will be captured on a mobile device. With this rising trend, users want to be able to easily share and store their content across multiple devices and operating systems - in a seamless, intuitive and secure way.

SanDisk Intros First Memory Cards Designed for Dashcams

SanDisk Corporation, a global leader in flash storage solutions, today introduced the company's first high endurance microSDXC memory card built to withstand up to 10,000 hours of Full HD Video recording.

Leveraging its deep expertise in NAND flash and systems technology capabilities, SanDisk developed a proprietary technology and process to enable high-intensity recording. Through rigorous testing, the new technology has proven itself to enable the company to reach a new milestone -- a 64GB microSDXC card that allows consumers to write and rewrite up to 10,000 hours of Full HD video recording.

Samsung Introduces Industry's First 128-Gigabyte UFS for Smartphones

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it is now mass producing the industry's first 128-gigabyte (GB) ultra-fast embedded memory based on the much-anticipated Universal Flash Storage (UFS) 2.0 standard for next-generation flagship smartphones. The new embedded memory's UFS 2.0 interface is the most advanced JEDEC-compliant, next-generation flash memory storage specification in the world.

"With our mass production of ultra-fast UFS memory of the industry's highest capacity, we are making a significant contribution to enable a more advanced mobile experience for consumers," said Jee-ho Baek, Senior Vice President of Memory Marketing, Samsung Electronics. "In the future, we will increase the proportion of high-capacity memory solutions, in leading the continued growth of the premium memory market."

JEDEC Announces Publication of e.MMC Standard Update v5.1

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD84-B51: Embedded MultiMediaCard (e.MMC), Electrical Standard (5.1). e.MMC v5.1 defines new features and updates for this embedded mass-storage flash memory that is widely used in smartphones and other mobile devices. Intended to facilitate an enhanced end user experience, the new version of e.MMC offers command queueing for the first time, and also defines important security updates. JESD84-B51 is available for free download from the JEDEC website.

The new revision of the standard defines e.MMC Command Queueing, which supports the optimized execution of commands within the device, versus the single thread protocol defined in prior versions of the standard. Command Queueing will enable the device to analyze commands before executing them, thereby maximizing effectiveness of the e.MMC memory storage. This will result in a positive effect on random read performance and read latency, thereby improving the end user experience.

Class Action Lawsuit Filed against NVIDIA over GTX 970 Memory Issue

We haven't heard the last of NVIDIA's GeForce GTX 970 memory allocation controversy, not by a long shot. Owners of the card, after having compiled technical information and details over weeks, filed a class-action lawsuit in a US Court (District Court for the Northern District of California). The lawsuit, titled "Andrew Ostrowsky (and others in similar situation) vs. NVIDIA Corporation and GIGABYTE Global Business Corporation," accuses the defendants of unfair, unlawful, and deceptive business practices, in three separate charges, and misleading advertising, demanding for Jury Trial.

The lawsuit goes on to read that the amount in controversy exceeds US $5 million, and encompasses over 100 Class members, meeting the minimal diversity clause, with the plantiff and numerous Class members being citizens of different states than the defendants. The lawsuit accuses the defendants of misleading buyers of the GeForce GTX 970 graphics cards with memory amount (being 3.5 GB with a 0.5 GB "spillover," and not the advertised 4 GB), ROP count being 56 and not 64 (as communicated to the media at launch, and to buyers through them); and L2 cache amount being 1.75 MB and not 2 MB. If you are eligible to be a Class member, find details of the law firms involved in the lawsuit document.

PNY Reveals Their Versatile Range of Hook Series USB Flash Drives

PNY Technologies, Inc. ("PNY"), world renowned manufacturer of USB and Memory products, has officially released an assortment of Hook Series USB Flash Drives. These metal Flash Drives feature a unique design that sets them apart from other USB Drives available in the market today. Each of these USB Flash Drives feature an integrated hook-and-lock mechanism that offers safe and secure storage for all of your important files.

Specially crafted with high-quality metal housing and polished designs, each of the PNY Hook USB Flash Drives are durable enough to withstand daily and rigorous use. These flash drives can hook on to everything that it is attached. You can attach your Hook USB Drive to your wallet, bag, purse, belt loops and other accessories. The Hook series of PNY USB Flash Drives are ultra-compact and extremely portable in size - perfectly suited to carry your files anytime and anywhere.

Apacer Announces the Blade DDR4 Memory Series

With a tactical saber in hand, the strongest survivor in the battle can draw on minimal resources to turn it around and win victory. Apacer launches cross-generation DDR4 flagship - "BLADE" DDR4 overclocking memory module, which is compatible with Intel Haswell-E processor and X99 chipset and boasts a clock rate up to 3300 MHz, providing unprecedented computing performance and energy-saving efficiency. The unique "saber-type" design of heat spreader achieves excellent heat dissipation efficiency, which ensures stable high-speed computing. Whether in win-lose battles of eSports or fierce overclocking competitions, "BLADE" series always secure players' victory.

Crucial Ballistix Elite DDR4 Memory Now Available

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of Crucial Ballistix Elite DDR4 memory. Designed to enhance high-performance gaming environments and push performance limits, the new modules deliver introductory speeds starting at 2666 MT/s, and allow users to radically increase bandwidth to 21 GB/s. Ballistix DDR4 memory also delivers up to 40 percent better power efficiency than standard DDR3 memory.*

Ballistix Elite DDR4 memory is optimized for the latest Intel X99 platforms with support for XMP 2.0 profiles, and features a custom-designed black PCB and anodized aluminum heat spreaders for improved heat dissipation. Supported by the exclusive Ballistix Memory Overview Display (M.O.D.) utility, which provides the ability to read information from the module, including real-time temperature from the integrated thermal sensor, voltages and more, all to aid overclocking efforts.

Samsung Starts Mass Producing Industry's First 8 Gb GDDR5 Memory

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first 8 gigabit (Gb) GDDR5 DRAM, based on the company's leading-edge 20-nanometer (nm) process technology. GDDR5 is the most widely used discrete graphics memory in the world.

Designed for use in graphics cards for PCs and supercomputing applications, and on-board graphics memory for game consoles and notebook PCs, discrete graphics DRAM provides an extensive amount of bandwidth to process large high quality graphically-oriented data streams. With the rising popularity of 3-D games and UHD video content soon to be widespread, the need for high-performance, high-bandwidth graphics memory has begun to rapidly increase.

Kingston Also Shows off HyperX Predator DDR4 and HyperX Fury DDR4 Memory

Kingston showed off its newest DDR4 memory modules, the HyperX Predator DDR4, and the HyperX Fury DDR4. Having first made its debut at PAX Prime, last August, the HyperX Predator DDR4 will be Kingston's flagship desktop memory module, with its tall compound aluminium heatsinks, chunky 10-layer PCBs with thick heat-dissipating copper layers, and some of the tightest memory timings, to go with some of the highest DRAM clock profiles, packed into their XMP profiles.

The HyperX Fury, on the other hand, will be Kingston's performance-value kit, coming in several sub-3000 MHz points. With a heatspreader that doesn't stick up beyond a standard module height, the HyperX Fury is targeted at high-end gaming PC builds, while the HyperX Predator targets enthusiasts and overclockers. Kingston set up a demo rig with a Core i7 "Haswell-E" processor, eight HyperX Predator modules running at DDR4-3000 speeds with around 64 GB/s of reads, 48 GB/s writes, and 67 GB/s mem-copy speeds, measured using AIDA64, with timings of 15-16-16-39-CR2T, and under stress from an FHD video playback.

ADATA Shows Off XPG V3 DDR3 Memory

ADATA showed off its third-generation XPG DDR3 memory module. A departure from its pointy gold heatsink design of the XPG Z1 series, the XPG V3 features a more conventional, 2-tone aluminium heatsink design, with three layers of fins projecting upward. The outer fins dissipate heat drawn from the DRAM chips, while the inner, colored ones (red, blue, green, gold, and orange), dissipate heat drawn a heat-spreading copper layer in the module's PCB. The module on display at CES featured a red inner heatsink, with an XMP 1.3 profile for DDR3-3100 MHz, with a 1600 MHz failsafe JEDEC profile.

Crucial Introduces New Ballistix Sport and Tactical DDR4 Gaming Memory

Crucial, a leading global brand of memory and storage upgrades, today announced new Crucial Ballistix Sport LT DDR4 memory and new Ballistix Tactical DDR4 memory. The new modules offer a combination of sleek design, DDR4 performance, and proven reliability for gamers to own the competition.

Designed for mainstream users who simply want to get more performance out of their systems, Ballistix Sport LT DDR4 memory delivers fast speeds and increased bandwidth. A new addition to the current Ballistix Sport DDR4 lineup, Sport LT modules feature a covert digital camo design and integrated heat spreader. Whether gamers want plug-and-play installation or Intel XMP 2.0 profiles to achieve DDR4 speeds of 2400 MT/s, Ballistix Sport LT memory delivers seamless, affordable performance.

Crucial Launches DDR4 SO-DIMM Memory

Crucial, a leading global brand of memory and storage upgrades, today announced new Crucial DDR4 SODIMMs, designed to enhance next-generation laptop performance. The new DDR4 modules are more than 30 percent faster than their DDR3 equivalents with speeds of 2133 MT/s, enabling systems to load applications faster and run demanding programs without lag.

Operating at 1.2V compared to 1.5V for standard DDR3 memory, Crucial DDR4 SODIMMs consume 20 percent less voltage than standard DDR3 technology. The reduction in voltage combined with other DDR4 efficiency features leads to an overall power reduction of up to 40 percent, which helps extend battery life. Additionally, Crucial DDR4 SODIMMs increase memory bandwidth by more than 30 percent, allowing systems to handle more data at once.

ADATA Launches its Gold Edition XPG Z1 DDR4 Overclocking Memory

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launches the Gold Edition of its XPG Z1 DDR4 overclocking memory, clocking in at the outrageously high speeds of 3000/3200/3300/3333MHz. Besides supporting the latest Intel Haswell-E platform, ADATA's XPG Z1 Gold Edition DDR4 also provides ultimate performance for gamers, overclockers and PC enthusiasts, and also features higher power efficiency.

DDR4 memory surpasses legacy DDR3 with improved performance and lower power consumption. The operating voltage of XPG Z1 has decreased from 1.5V to 1.35V, a 10% reduction of power that helps your system operate at a lower temperature for more stable operation. With speeds of up to 3333MHz, CL16-16-16 timings and a transfer bandwidth reaching 26.6GB/s, the XPG Z1 Gold Edition provides unparalleled data transfer efficiency. In addition, the built-in Intel XMP 2.0 Serial Presence Detect (SPD) allows quick and easy installation without changing BIOS settings, all while facilitating full system usage and enhanced stability. This adds up to a true game-winner for overclockers seeking an extra edge.

Samsung Starts Mass-producing First 8 Gigabit LPDDR4 Mobile DRAM

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has started mass producing the industry's first 8 gigabit (Gb), low power double data rate 4 (LPDDR4) mobile DRAM based on the company's leading-edge 20-nanometer (nm) process technology. LPDDR memories are the most widely used "working memory" for mobile devices worldwide.

"By initiating production of 20nm 8Gb LPDDR4, which is even faster than the DRAM for PCs and servers and consumes much less energy, we are contributing to the timely launch of UHD, large-screen flagship mobile devices," said Joo Sun Choi, Executive Vice President of Memory Sales and Marketing at Samsung Electronics. "As this major advancement in mobile memory demonstrates, we will continue to closely collaborate with global mobile device manufacturers to optimize DRAM solutions, making them suitable for next-generation mobile OS environments."

Ozone Launches Argon Ocelote World Gaming Mouse

Ozone launches the Argon Ocelote World gaming mouse. The official launch of the new mouse Argon Ozone-OceloteWorld was 8th December in European countries, and it will be available worldwide from 12th January at Ozone's official resellers. The mouse was presented past 7th December at Gamergy Madrid by Ocelote

This product has been designed to bring together the expertise of Ocelote and the advanced technique of Ozone Gaming's engineering team to cover the most demanding needs of the gaming community, with the aim to improve the gaming experience of the user.

MSI Announces Radeon R9 290X Gaming 8GB Graphics Card

MSI is proud to announce the availability of the new R9 290X GAMING 8G graphics card. Packed with 8 Gigabyte GDDR5 memory operating at 5500MHz and all the extra features stuffed with it, the new 290X GAMING 8G is sure to drive UltraHD gaming resolutions without any problem. The MSI Twin Frozr IV Advanced ensures your card runs cool so you can enjoy maximum performance while AMD's PowerTune technology enables the R9 290X GAMING 8G to run at highest clock speeds.

With support for the latest industry standards and thrilling new technology such as Mantle support in Battlefield 4. Thanks to the bundled MSI GAMING App gamers can quickly switch between three pre-sets including a silent mode optimized for power efficiency and an overclocking and OC Mode to get the most power out of your graphics card, without worrying about learning how to overclock. The R9 290X GAMING 8G has been designed to give you a fluid and silent gaming experience that delivers you true next-gen performance for 4K UHD resolutions and up, without sacrificing on thermals or noise.

Samsung Starts Production of 8-Gigabit DDR4 Based on 20 Nanometer Technology

Samsung Electronics announced that it is mass producing the industry's most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

"Our new 20 nm 8 Gb DDR4 DRAM more than meets the high performance, high density and energy efficiency needs that are driving the proliferation of next-generation enterprise servers," said Jeeho Baek, Vice President of Memory Marketing at Samsung Electronics. "By expanding the production of our 20 nm DRAM line-ups, we will provide premium, high-density DRAM products, while handling increasing demand from customers in the global premium enterprise market."
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