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I'M Intelligent Memory Debuts 8 Gb DDR3 Components, 16 GB Modules

I'M Intelligent Memory, a Hong Kong based fabless DRAM manufacturer, announces availability of the world's first 8 Gigabit (Gb) DDR3 components with a single chip-select, doubling the amount of memory per chip compared to other DDR3 DRAM devices on the market. Based on these new 8 Gb components, I'M is also introducing the first 16 Gigabyte (GB) DDR3 UDIMM and SO-DIMM memory modules with optional ECC error-correction.

The JEDEC specification JESD79-3 has always allowed an 8 Gb density for DDR3 memory devices. While most DRAM manufactures are waiting for a 2x nm process to fit such high memory capacity into a single DRAM IC package, I'M has developed its own a revolutionary way to manufacture 8 Gb DDR3 components with single chip-select utilizing existing 30 nm manufacturing technologies.

ADATA to Display New SSDs, DDR4 Memory and High Capacity Memory

ADATA Technology Co., Ltd., is honorably invited by Intel as a strategic partner to the Grantley New Platform Workshop. During the 4 day event taking place on June 24th & 25th in Hillsboro, Oregon and July 9th & 10th in Hudson, Massachusetts, ADATA will proudly demonstrate the latest DDR4 server DIMMs, DDR3 LR-DIMMs, and complete product line of 2.5" SSDs and PCIe SSDs. One of the primary showcases will be server grade DDR4 R-DIMMs supporting the latest Intel Xeon processor E5-2600 v3 series with the features of up to 16 GB density, 1.2V low power consumption, and maximized 2133 MHz high speed transmission. ADATA's DDR4 product line includes DDR4 RDIMMs, VLP R-DIMMs, LR-DIMMs, and ECC SO-DIMMs.

In-memory computing stores data on memory chips rather than hard drives removes any performance bottleneck caused by traditional storage. ADATA DDR3 LR-DIMMs 64GB and R-DIMMs 32GB (with Invensas DFD technology) support In-memory computing with high capacity and outstanding performance. In Intel New Platform Workshop, ADATA will demonstrate DDR3 LR-DIMMs, which deliver up to 64GB capacity for Intel Xeon processor E5 V2 family-based servers, and increase total memory capacity by up to 1.5 TB to fulfill In-Memory Computing application.

Micron Collaborates With Intel to Enhance "Knights Landing"

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron's Hybrid Memory Cube products.

"The ecosystem is changing and the importance of scalable on-package memory and memory bandwidth is now coming to light," said Chirag Dekate, Research Manager at IDC. "Memory is at the heart of the solution space which will benefit both big compute and big data. This announcement is a clear validation of how Micron is advancing the role and impact of memory on systems and the value that 3D memory can deliver."

HyperX Releases Impact SO-DIMMs, FURY SSD at COMPUTEX TAIPEI

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the launch of HyperX Impact memory for gamers and enthusiasts who want to upgrade and boost performance in their laptops and small form factor PCs. HyperX Impact replaces the current SO-DIMM offerings under Genesis, PnP and LoVo into one family.

HyperX Impact achieved a world record for the fastest SO-DIMM frequency running at 2666 MHz. A video of that performance can be seen here. HyperX Impact is available in frequencies ranging from 1600 MHz to an industry-fastest 2400 MHz in capacities of 4 GB and 8 GB single modules and 8 GB to 16 GB kits of 2.

HyperX Sets Overclocking World Record Mark at 4500 MHz, Partners with HWBOT

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced its memory was overclocked to 4500 MHz, the highest frequency in the world. The mark was set by overclocker "Hicookie" of GIGABYTE. He achieved the frequency using one 4 GB HyperX DDR3 2933MHz module (not yet available) on the new GIGABYTE Z97X-SOC FORCE LN2 motherboard.

The frequency is posted on HWBOT, the premier site for PC enthusiasts looking for news, tips and information on overclocking, benchmarks and competitions. Beginning June 1, HyperX officially became the newest partner with HWBOT. Together with HWBOT, HyperX looks forward to continuing its association with the overclocking community.

Panram Unveils Ninja-V DDR4 Memory Modules

Panram unveiled its first consumer DDR4 memory modules, ready for upcoming Haswell-E HEDT platform, the Ninja-V. Equipped with simple and contemporary looking heatspreaders that aren't much taller than the module itself, the first Ninja-V modules will stick to JEDEC standard speeds of DDR4-2133. They'll run at 2133 MHz, with standard timings, and module voltage of 1.2V. The company will launch the Ninja-V towards the end of this year, when Intel launches the Haswell-E HEDT platform, which features a quad-channel DDR4 IMC, which could offer system memory bandwidths in excess of 80 GB/s.

Crucial DDR4 Server Memory Now Available

Crucial, a leading global brand of memory and storage upgrades, is now shipping DDR4 server memory. Designed to enable next generation enterprise environments with increased speed, bandwidth, and energy efficiency, Crucial DDR4 server memory modules are available for immediate purchase through select global channel partners and at crucial.com.

The modules are up to twice as fast and deliver double the memory bandwidth over DDR3 technology when it was introduced (1066 MT/s and 8.5 GB/s with DDR3 vs. 2133 MT/s and 17 GB/s on DDR4), and are expected to get even faster as the technology matures. Operating at 1.2V, Crucial DDR4 server memory uses up to 20 percent less voltage than DDR3 technology when it was introduced (1.5V). In addition, Crucial DDR4 server memory can be up to 40 percent more energy efficient than previous generations of DDR3 memory, when coupled with other technologies introduced with DDR4. Crucial DDR4 server memory is optimized for future Intel Xeon processor E5-2600 v3 product family-based systems.

GeIL EVO Leggera Line of DDR3 Memory Unveiled

GeIL showed off its EVO Leggera line of compact full-height DDR3 memory modules, which offer high memory frequencies using XMPs, without needing over the top heatspreaders that obstruct CPU coolers. The Leggera is characterized by azure blue heatspreaders, and the underlying DIMM is put through GeIL's own trial-by-fire, the DBT, before being packaged. The EVO Leggera will be sold in two-module dual-channel kits of 8 GB (2 x 4 GB) and 16 GB (2 x 16 GB).

SanDisk and Toshiba License Memory Technology IP from Intermolecular

Intermolecular, Inc. - accelerating research and development for semiconductor and clean energy industries - today announced that SanDisk and Toshiba have jointly elected to take an exclusive license, in a limited field, to Intermolecular's rights in the intellectual property developed under the collaborative development program (CDP) and Intermolecular's background intellectual property thereto. The related technologies have been developed for next-generation memory.

The companies' CDP with Intermolecular, specifically aimed at developing certain memory products, materials, processes and device technologies, was concluded on March 15, 2014. Under the terms of the exclusive license, SanDisk and Toshiba will prepay non-refundable royalties in quarterly installments over a predetermined period.

HyperX DDR3 Memory Supports Intel Haswell Refresh and 9-series Chipset

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced its three memory product lines: FURY, Genesis and Predator, offer a series of dual-channel kits compatible with the new Intel fourth-generation Core i5 and i7 processors and Intel 9 series chipset. HyperX worked closely with leading motherboard partners to guarantee compatibility and the highest performance.

Compatible Intel HyperX memory is available in frequencies ranging from 1333MHz to 2800MHz, and in various combinations from 8GB to 32GB in kits of two and four. A complete list of dual-channel compatible kits is available here. HyperX memory is 100-percent tested and backed by a lifetime warranty, free technical support and legendary Kingston reliability.

PANRAM Presents the Light Sword Gaming DDR3 Memory

PANRAM co. was founded in 1994, a brand which until today has been unknown to most of us. Even though PANRAM as a brand are fairly unknown by their own name, they are the OEM for other brands producing up to 3 million units per month. Today, the manufacturer decided to use own experience, patents, quality control and combine it along with market knowledge of Caseking distributor to gain it's own recognition in the market. Together, Caseking and PANRAM are presenting today a new series of PANRAM, Light Sword. Light Sword has a red LED backlight, which resembles the shape of the legendary lightsaber.

"We wanted to release together unique high-end memory that differentiate from anything we have ever seen." says head of memory division at Caseking - Jens Becker. Each piece of Light Sword has specially selected integrated circuits for easier overclocking capabilities. PANRAM says that for example 2400 MHz model can be turned up to a speed of 2666 MHz without bigger problems and with using the same latency.

Crucial Now Sampling Next-Generation DDR4 Server Memory

Crucial, a leading global brand of memory and storage upgrades, is now sampling DDR4 server memory through its new Technology Enablement Program. Aimed at channel partners who are currently developing or evaluating DDR4-capable platforms, the program provides early access to select Crucial server DDR4 modules and relevant technical resources, as well as notification of new modules as they become available. The Crucial Technology Enablement Program comes on the heels of Micron's recent ramp up in DDR4 production.

Designed to enable next generation enterprise environments, Crucial DDR4 server memory delivers data rates that start at 2133 MT/s (up to twice as fast as DDR3 when it was introduced) and is expected to get even faster as the technology matures. What's more, when used with Intel Xeon processor E5-2600 v3 product family-based systems, Crucial DDR4 server memory doubles memory bandwidth from 8.5 GB/s to 17 GB/s. Additionally, Crucial DDR4 memory uses up to 20 percent less voltage than DDR3 technology, operating at 1.2V compared to 1.5V for standard DDR3 memory, and delivers up to a 40 percent reduction in power usage.

G.SKILL Ripjaws Releases DDR3L 32GB 2133MHz SO-DIMM Memory

G.SKILL International Co. Ltd., the leading high performance memory designer and manufacturer, is proud to announce the release of an even higher performance, higher capacity DDR3L SO-DIMM memory kit at 2133MHz! This time with a massive 32GB (4x8GB) capacity! Operating at a low voltage of 1.35V and at a timing of 11-11-11-31, this new Ripjaws SO-DIMM memory kit will elevate the performance of your extreme performance gaming laptop to new heights. Desktop performance and capacity on a laptop is now a reality!

The following is a test screenshot completed on the MSI GT70 2OC gaming laptop, exhibiting stability under extreme load. "As a world leading gaming brand, MSI Notebook's goal is to become the most trusted name in gaming and e-sport. We stand by our principles of breakthroughs in design, the pursuit of excellence, and technological innovation as we have continued to raise the bar for ourselves and have accomplished a great deal of pioneering work in the industry," commented Sam Chern, marketing director at MSI.

Toshiba Debuts World's Fastest microSD Memory Cards

Extending its industry leadership in memory card solutions, Toshiba America Electronic Components, Inc., (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, has introduced the world's fastest microSD memory cards. The new cards are the first in the industry to comply with the UHS-II interface standard, the ultra high speed serial bus interface defined in the SD Memory Card Standard Ver. 4.20. Available in 32 GB and 64 GB capacities, Toshiba's new microSD memory cards offer the fastest transfer rates available, are UHS Speed Class 3 (U3) enabled, and allow high-quality 4K video capture at constant minimum write speeds of 30 MB/s. This means that 4K2K video, live broadcast and content can be recorded on high-performance cameras.

The 64 GB cards offer a maximum read speed of 260 MB/s and a maximum write speed of 240 MB/s. The 32 GB cards have a maximum read speed of 145 MB/s and maximum write speed of 130 MB/s, which represents an 8x write speed improvement and 2.7x read speed improvement when compared to Toshiba's current 32 GB microSD UHS-I cards. These faster transfer speeds reduce the time required to download large data movie and music files to smart phones and tablets, and enable camera users to shoot high resolution digital still images in a continuous high speed shooting mode.

HyperX Releases 'FURY' Memory Line

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced the launch of HyperX FURY memory for entry-level gamers and enthusiasts. HyperX FURY replaces the HyperX blu memory line. The new, next-generation high-performance memory offers automatic overclocking with an asymmetric, aggressive heatspreader design for the ultimate cost-efficient enthusiast computer experience.

HyperX FURY memory is fully Plug and Play (PnP) so it automatically overclocks within the system speed allowance without any manual BIOS tuning. The new heatspreader design comes in four colors (blue, black, red, and white) and features black PCB to enable gamers, modders and system builders to have color matched systems. HyperX FURY is available in 1333 MHz, 1600 MHz, and 1866 MHz frequencies.

Samsung Accelerates Ramp Up of DDR4 Production

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, said today that it is accelerating its production ramp up of DDR4 memory modules to accommodate an anticipated strong market demand along with the approaching introduction of the new Intel Xeon processor E5-2600 v3 product family. DDR4 is the most advanced memory for server and high-performance computing applications.

"At Samsung, we are taking the lead in readying the DDR4 market to coincide with the introduction of the next-generation Intel Xeon processor E5-2600 v3 product family, and plan to contribute to creating a bigger market for DRAM in the second half of 2014," said Jim Elliott, corporate vice president, Memory Marketing, Samsung Semiconductor, Inc. "We will continue to introduce high-density DDR4 modules for global OEMs that will facilitate the launch of next-generation enterprise servers and will maximize IT investment efficiency."

Micron Technology Debuts DDR4 Modules for Intel Xeon E5-2600 v3 Systems

Micron Technology, Inc., a leading provider of advanced memory and storage solutions for enterprise data centers and high-performance computing applications, today announced it is ramping production of DDR4 memory to support upcoming Intel CPU launches. The improved power and performance of DDR4 technology is a critical requirement for the growing enterprise computing market, delivering a power improvement of up to 35% compared to standard DDR3.

Micron is ramping its 4 Gb-based DDR4 module production at 2133 megatransfers per second (MT/s) in support of Intel's Xeon processor E5-2600 v3 product family-based systems. Micron is also sampling a 2400 MT/s device in anticipation of follow-on products targeted for 2015.

I'M Intelligent Memory Announces High Capacity DDR2 SDRAM ICs

With capacities of up to 4 Gigabit per chip, I'M Intelligent Memory, a Hong Kong based fabless DRAM manufacturer, enters the market for industrial DDR2 memory components with their mission statement "Beyond Limits".

DDR2 SDRAM technology is the memory standard that most industrial applications have been designed around for years. I'M pushes this technology even further by offering higher capacities and wider temperature ranges than other manufacturers. The most common densities of DDR2 continue to be 512 Mb and 1 Gb. The larger capacities, such as 2 Gb and 4 Gb, are defined by JEDEC, but their availability from other manufacturers continues to be very limited. I'M Intelligent Memory focuses on the high end of DDR2 capacities with their 2 Gbit monolithic, 2 Gbit Dual-Die (DDP) and 4 Gbit DDP components in standard or industrial temperature ranges. For automotive customers, AEC-Q100 versions are also available.

Team Project X Series Memory Creates Super Pi 32M World Record

TeamGroup announced the new world record of Super Pi 32M (Air Cooling) on Jan. 22, 2014. Working together with HKEPC OC Lab in Hong Kong, TeamGroup overclocking memory module has achieved new record" 4min 38sec 329ms ", not only placed among the Top 5 world record of Super Pi 32M, but also the only non-extreme cooling record in Top 10 Global Ranking.

Super Pi 32M is the most popular test program for pro overclockers to compare the performance and stability of their computers. It's also one of the main items in HWBOT Global Ranking. By using Gauss-Legendre algorithm, it can accurately calculate π to 232 square roots--the 32M digits after decimal point and need extremely high stability of system memory. Beside the performance of processor, memory module clock and low latency timing are also the keys of computing speed. Shorten the computing time is the target for overclockers around the world to compete.

ADATA Shows Off DDR4 Modules at CES

Taiwanese company ADATA Technology is gearing up for the arrival of DDR4 and at CES it showcased a couple of memory modules based on the standard. ADATA's DDR4 sticks have 8 GB and 16 GB capacities and run at 2133 MHz with CL15 latencies while powered at 1.2V.

The modules on display are 'suitable for servers' (they are R-DIMMs) but the company will surely have some consumer-oriented offerings for later this year when Intel launches the DDR4-supporting Haswell-E processors.

Mushkin Unveils New Frostbyte II Memory Heatsink

Mushkin Enhanced Mfg., an industry-leading designer and manufacturer of high-performance and mission-critical computer products, has unveiled the new refreshed FrostByte heatsink for Blackline and Redline memory modules.

Cut from aircraft-grade aluminum, the FrostByte is the newest model of durability and functionality. The new FrostByte heatsink utilizes our new vortex thermal design to dissipate and control accumulated heat while maximizing PC performance.

SK Hynix Develops 8 Gb LPDDR4 Memory

SK Hynix Inc. announced that it has developed the world's first 8 Gb (Gigabit) LPDDR4 (Low Power DDR4) using its advanced 20 nm class technology. LPDDR4 is the next generation mobile DRAM interface on the process of standardization which features ultrahigh speed and low power consumption.

This new product works at 3200 Mbps and ultra low-voltage of 1.1V which runs two times faster than 1600 Mbps and does at lower voltage than 1.2V of existing LPDDR3. The Company has been strengthening its cooperation with the customers for the standardization of this new mobile DRAM by providing the samples of LPDDR4 to major customers and SoC(System on Chip) companies.

Crucial Announces New Memory Lineup for Mac Pro Systems

Crucial, a leading global brand of memory and storage upgrades, today released a new lineup of high-performance memory solutions specifically designed for the new Mac Pro systems. This new memory is engineered to meet the component densities, speeds, and Serial Presence Detect (SPD) programming specifications of the new Mac Pro workstations, and is now available in densities up to 16 GB through select global channel partners and at www.crucial.com.

The new modules designed for Mac Pro workstations operate at 1866 MHz, which is the fastest mainstream DDR3 ECC UDIMM and RDIMM speed currently available, allowing users to leverage all the capabilities of the new Mac Pro systems. For further performance gains, modules are available in densities up to 16 GB. These high-speed, high-density memory modules provide users with increased system responsiveness, faster application load times, and an increased ability to multitask with ease when using data-intensive programs such as Apple FinalCut Pro or Adobe Photoshop software.

Avexir Debuts the Blitz 1.1 Series Memory

The Avexir brand is an established manufacturer associated with producing top quality, high-end RAM memory. Avexir is one of the only manufactures in which the factories hand check each module when it comes to overclocking and working in dual and quad channel modes. The modules are packed into elegant boxes only when they pass thorough quality control tests on different systems including AMD and Intel processors. Other manufacturers unfortunately don't do such controlled hand quality checks, which means users are more likely to encounter a faulty DDR module, which can cause incompatibilities and headache for the user.

Avexir presents today on European market five new series of quality checked memories:
  • Avexir BLITZ 1.1 Original White LED
  • Avexir BLITZ 1.1 OCF Yellow LED
  • Avexir BLITZ 1.1 ELG Yellow LED
  • Avexir BLITZ 1.1 ELR Red LED
  • Avexir BLITZ 1.1 GBOC Orange LED

SMART Introduces New Memory Module Form Factor

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced MIP, the industry's first module-in-a-package memory form factor. SMART's innovative tiny form factor design is targeted for broadcast video, mobile router, high-end video/graphics cards and embedded computing applications where power consumption, performance and space limitations are of principle concern.

While SMART's MIP occupies just one-fifth the area of an SO-DIMM, it offers higher performance and consumes less power. Key improvements with MIP include 42% power savings, 42% jitter reduction, and 39% PK/PK savings. Being a "soldered down" module, unlike an SO-DIMM, the need for a mating connector is eliminated with MIP. SMART's MIP supports both, applications requiring ECC and the ones that do not. These are key benefits for applications where memory capacity in a small space is critical. And unlike other DRAM down-board usage scenarios, the MIP contains on-package address and CNTRL termination.
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