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Upcoming Hardware Launches 2023 (Updated Feb 2024)
(391 Comments) »Introduction
In this article, which our team will regularly update, we will maintain a growing list of information pertaining to upcoming hardware releases based on leaks and official announcements as we spot them. There will obviously be a ton of rumors on unreleased hardware, and it is our goal to—based on our years of industry experience—exclude the crazy ones. In addition to these upcoming hardware release news, we will regularly adjust the structure of this article to better organize information. Each time an important change is made to this article, it will re-appear on our front page with a "new" banner, and the additions will be documented in the forum comments thread. This article will not leak information we signed an NDA for.Feel free to share your opinions and tips in the forum comments thread and subscribe to the same thread for updates.
Last Update (Feb 12th):
- Updated AMD Zen 4 for Socket AM4
- Updated AMD Zen 5 / Ryzen 9000 Series
- Added Intel Bartlett Lake-S
- Updated Intel Grand Ridge
- Updated Intel Arrow Lake
- Updated Intel Lunar Lake
- Updated Intel Panther Lake
- Updated Intel Granite Rapids
- Added Intel Nova Lake
- Added AMD Radeon RX 7700 Non-XT
- Added AMD Radeon RX 7800 Non-XT
- Updated AMD RDNA 4 / Radeon RX 8000 Series
- Updated Intel Alchemist+ Architecture
- Updated Intel Battlemage Architecture
- Updated Intel Celestial Architecture
- Added AMD X690E Chipset
- Added AMD X870E Chipset
- Added AMD X870 / B850 / B450 Chipsets
- Updated GDDR7 Graphics Memory
- Updated HBM3e Graphics Memory
- Updated HBM4 Graphics Memory
- Updated TSMC 2 nanometer
- Updated Samsung 3 nanometer
- Updated Samsung 2 nanometer
- Updated Intel 18A
- Added Samsung 280-layer 3D NAND QLC Flash
- Removed launched products: AMD Zen 4 APUs for Socket AM5, AMD Phoenix 2 APU, Intel Raptor Lake Refresh Mobile, Intel Meteor Lake, Intel Emerald Rapids, GeForce RTX 4070 Super, 4070 Ti Super, 4080 Super
- Removed NVIDIA GeForce RTX 4050, which was launched as RTX 4060 non-Ti
- Removed Zhaoxin Discrete GPU, of which we haven't heard anything for years
Processors
AMD Zen 4 for Socket AM4 [updated]
- Release Date: Unknown
- Possibly canceled considering that we're getting closer to the launch of Zen 5
- Based on Zen 4 CPU cores paired with Zen 3's IO die
- Support for DDR4 and PCIe Gen 4
AMD Zen 5 / Ryzen 9000 Series [updated]
- Release Date: May/June 2024 #
- 5 nm or 3 nm TSMC process
- DDR5 memory support
- PCI-Express Gen 5
- Codename "Granite Ridge" #
- 16 Zen 5 cores across up to two CCDs #
- Another codename "Strix Point" could feature big.LITTLE core design, similar to Alder Lake
- Strix Point is a Hybrid Architecture, with 4 P-Cores and 8 E-Cores # #
- P-Cores and E-Cores use same instructions and everything, just different cache sizes and clocks #
- Another leak suggests Strix Point is a monolithic 12c/24t design #
- "Strix Halo" is a mobile SoC with 16 Zen 5 cores, 40 CU GPU, 256-bit LPDDR5X memory, 120 W TDP #
- Strix Halo uses a different IO die #
- Fire Range is a 16 core successor to Dragon Range using Zen 5 with X3D cache #
- Strix Point IGP is based on RDNA 3.5 architecture #
- 16 CUs in IGP #
- Server platform codename "Turin"
- CCD codename: Eldora #
- Core codename: Nirvana #
- Uses Socket SP5 for server, desktop uses Socket AM5
- CCDs built on 4 nm TSMC #
- Die size 224 mm² #
- Shrink to 3 nm possible later in the lifetime of the product
- Could also be built on 3 nm TSMC #
- 3DV Cache included with specific SKUs
- New frontend with better parallelism
- All processors come with integrated GPU
- Improved branch predictor #
- Estimated IPC gain 15% #
- Pipeline redesign: 6 ALUs vs 4 on Zen 4, 4 Address Generation Units (AGUs) vs 3 on Zen 4, floating point store pipelines doubled, now 256-bit each. #
- Performance estimate puts Zen 5 30% ahead of Zen 4 #
- Possibly same IO die as Zen 4 Ryzen 7000 #
- AI/ML enhancements, possibly Xilinx IP-based fixed function hardware, called AIE (AI inference accelerator)
- New AVX and AVX-512 instructions: AVX-VNNI, MOVDIRI, MOVDIR64B, AVX512VP2INTERSECT, and PREFETCHI #
- Phoenix point is built on 5 nm TSMC, with RDNA 3 graphics
- Mobile CPU: Kraken Point: 4P+4C cores, NPU, monolithic CPU, 4 nm TSMC EUV, IGP is RDNA 3.5 with 8 CU / 512 cores #
- Related: XDNA, which is the first AI-acceleration FPGA architecture by Xilinx
- XDNA2 is a next-generation on-chip neural processing architecture #
- Family ID of 26h #
AMD Zen 5 Threadripper / Threadripper 9000
AMD Zen 6
- Release date: Unknown
- Codename: Morpheus #
- 10% IPC increase over Zen 5 #
- New FP16 capabilities #
- 32-core CCX #
- Server codename: Venice #
- EPYC uses Socket SP7 #
Intel Bartlett Lake-S [added]
- Release Date: Probably 2024
- Uses Socket LGA 1700 #
- Product by the "Network and Edge" Business group (NEX), so maybe not designed for consumers #
- Uses Intel 7 process #
- Support for DDR4 and DDR5 #
- Could be launched as "15th Gen" #
- One source says same 24 cores design as Raptor Lake (8x P + 16x E) #
- Another source says this is a new P-Core only design with 12+0 cores #
- UHD Graphics 770 integrated graphics #
Intel Grand Ridge [updated]
- Release Date: Unknown, could be canceled
- Produced on 7 nm HLL+ process
- Successor to Atom "Snow Ridge"
- 24 cores across 6 clusters with 4 cores each
- 4 MB L2 per cluster, plus L3 cache
- Uses Gracemont CPU core
- Dual-channel DDR5
- PCI-Express Gen 4 with 16 lanes
Intel Rialto Bridge
- Release Date: Canceled as of Mar 2023 #
- AI and HPC data center GPU
- Up to 160 Xe cores
- OAM 2.0
- Uses tile based approach similar to Sapphire Rapids
Intel Falcon Shores
- Release Date: Unknown
- Successor to Ponte Vecchio #
- AI and HPC data center "XPU" #
- Used to be CPU+GPU, now GPU only #
- Ethernet, up to 288 GB of HBM3 at 9.8 TB/s #
- Support for FP8 and FP16 #
- Combines multiple tiles of various architectures #
Intel Arrow Lake [updated]
- Release Date: 2024 #
- Successor to "Meteor Lake"
- Uses Lion Cove P-Core architecture #
- Uses Skymont E-Core architecture #
- Core counts up to 8P+16E
- P-Cores get a performance uplift
- Same E-Cores as Meteor Lake
- Possibly no Hyper-Threading #
- Built on Intel 20A process
- 3 MB L2 cache for each P-Core #
- Graphics tile built on TSMC 3 nanometer #
- Uses Socket LGA1851, retains cooler compatibility with LGA1700 #
- Arrow Lake HX (ARL-HX, for mobile) uses BGA2114 #
- Leaked engineering sample: 8+16+1 core / 24 thread configuration, no Hyper-Threading, 3 GHz, No AVX512 #
- New CPU voltage regulator standard "Gen 5 VR" #
- 6% to 21% faster than Raptor Lake-S #
- New instructions for AI, AVX VNNI with INT8/INT16, AVX-IFMA and AVX-NE Convert. SHA512, SM3 and SM4 #
- Uses Z890, B860 and H810 chipsets, H870 canceled #
- DDR5 up to 6400 officially, higher with OC #
- Native Thunderbolt 4 #
- 24 native PCIe 5.0 lanes: 16 for graphics, 4x Gen 5 for M.2, 4x Gen 4 for M.2 #
Intel Lunar Lake [updated]
- Release Date: 2024 #
- Low power successor to Meteor Lake (U-segment and H-Segment) #
- Core Ultra 2-series branding #
- Live Demo shown at Intel InnovatiON event in Sep 2023 #
- Uses Intel 18A process paired with external foundry services #
- Lunar Lake Mobile (LNL-M) uses BGA2833 #
- 15 W ultra-low power CPUs #
- Design focus on performance per watt #
- Improvements to power conversion with help from Cirrus Logic #
- New instructions for AI, AVX VNNI with INT8/INT16, AVX-IFMA and AVX-NE Convert. SHA512, SM3 and SM4 (same as Arrow Lake) #
- Adds Total Storage Encryption (TSE) and PBNDKB instruction #
- Leaked low-power configuration: 17 W, 4+4, 20c 3.91 GHz + 2.61 GHz, 5M, 3.3 GHz IMC, 4x 2.5 MB + 4 MB L2, 2x 8 MB L3 #
- Lunar Lake-MX embeds 16 GB / 32 GB Samsung LPDDR5X-8533 memory on SoC package #
- Lunar Lake-MX package size is 27 x 27.5 mm #
- Lunar Lake-MX is 4P+4E, IGP is Xe²-LPG with 8 Xe cores #
Intel Panther Lake [updated]
- Release Date: 2025 #
- Successor to "Lunar Lake" #
- 17th Gen Intel Core processors #
- iGPU features Xe3 "Celestial" graphics architecture #
- AI performance doubled #
Intel Granite Rapids [updated]
- Release Date: H2 2024, after Sierra Forest #
- For enterprise / data center #
- Successor to Sapphire Rapids #
- Up to 120 Redwood Cove P-Cores (same cores as Meteor Lake) #
- Granite Rapids AP supports up to 2 CPUs, 12 channels DDR5 per CPU, DDR5 6400 MT/s 1 DPC / 5200 MT/s 2 DPC, 24 DIMMs per CPU #
- Another leaks suggests up to 128 cores #
- 8-channel DDR5 or more #
- Up to 500 W TDP #
- 88 lanes of PCIe 5.0 #
- BGA4368 package (soldered, not socketed) #
- Socketed Granite Rapids-SP CPUs use LGA 4710 #
- Granite Rapids-AP uses Socket BR with 7529 pins #
- Granite Rapids itself is just the compute die without memory controller for applications like Ethernet. Memory controller dies get added for the HCC (high-core-count) and XCC (extreme core count) variants. HCC has 1 MC with 4 channels, XCC has 2 MC with 8 channels #
- Introduces new AVX10 implementation #
- Support for APX/AVX10 coming to Linux #
- 480 MB of L3 cache #
- Intel 3 node (4 nm) #
- P-Cores only #
- Platform name: Eagle Stream
- Granite-Rapids AP platform: Birch Stream-AP #
Intel Sierra Forest
- Release Date: H1 2024 #
- Sampling as of March 2023 #
- Successor to Sapphire Rapids Xeons #
- For cloud, server and enterprise, high-density, efficiency compute #
- Platform name: Birch Stream #
- Uses Socket LGA-7529 # #
- Up to 500 W TDP #
- 12-channel memory #
- Intel 3 process #
- 144 cores #
- 288 cores in XCC model #
- 228 core model gets a multi-bench Geekbench 6 score of 7,770, which is higher than Xeon Platinum 8480+, but lower than the latter in single-threaded #
- Only E-Cores, no P-Cores #
- E-Cores are "Crestmont" architecture #
- Chiplet based like Meteor Lake #
- 5 tiles: 2x compute, 2x IO + 1 interposer #
- Compute tiles on Intel 3 #
- Each tile has 36 Sierra Glen E-Core clusters, 108 MB shared L3, 6-channel DDR5 #
- Each E-Core cluster features 4 cores with 4 MB L2 shared and one segment of 3 MB L3 #
- No SMT #
- Compute tiles: 578 mm², IO tiles: 241 mm² #
Intel Clearwater Forest
Intel Nova Lake [added]
NVIDIA Arm CPUs for Desktop
- Release Date: 2025
- NVIDIA plans to build Arm processors for use in desktop computers #
- Microsoft Windows operating system is supported #
Graphics / GPUs
NVIDIA GeForce RTX 4090 Ti / RTX Titan Ada
- Release Date: Possibly canceled # #
- Uses AD102 graphics processor (same as RTX 4090)
- 18432 core, 568 Tensor cores, 142 RT cores
- 24 or 48 GB of GDDR6X, 384-bit
- 600 W #
- Huge quad-slot cooler on the FE # #
- 22 heatpipes, three fans #
NVIDIA Blackwell
- Release Date: Q4 2024 # #
- Focused on compute (not gaming)
- Probably built on TSMC 3 nanometer #
- GPUs: GB202, GB203, GB205 and GB206 #
- No GB204 #
- Also just "B100" #
- 512-bit memory interface on flagship GPU #
- Uses TSMC 3 nm process #
- GB100 could be a MCM design #
NVIDIA Ada Next
AMD Radeon RX 7500 XT
- Release date: unknown
- Uses Navi 33 GPU #
AMD Radeon RX 7600 XT 10 GB and 12 GB
- Release date: unknown
- PowerColor has registered such models with the EEC #
AMD Radeon RX 7700 Non-XT [added]
- Release date: unknown
- Uses Navi 32 GPU #
AMD Radeon RX 7800 Non-XT [added]
- Release date: unknown
- Uses Navi 32 GPU #
AMD Radeon RX 7950 XT / XTX
- Release date: unknown
- Uses Navi 31 GPU #
AMD RDNA 4 / Radeon RX 8000 Series [updated]
- Release Date: 2024
- Uses Navi 4x GPU family
- Focus on gaming performance, without going overboard with AI #
- Improvements to draw calls #
- Possibly no plans for high-end GPUs, only x700 and below #
- Product stack tops out at $400, but with performance similar to RX 7900 XTX #
- Only Navi 44 and Navi 43 planned #
- Generation codename "GFX1200" #
- also "GFX1201" #
AMD Navi 4c
- Release Date: Possibly canceled #
- Embraces chiplet design even more #
- Separate dies for Shader Engines (SED) and Multimedia & IO (MID) #
- Shader Engine Dies could be built on 3 nanometer TSMC #
- Uses an active interposer (AID) #
AMD CDNA 3
- Release Date: 2023
- GPU compute focused architecture
- Combined x86 CPU cores with GPU compute units
- 5 nm TSMC process for compute dies
- 6 nm IO die
- Infinity Cache
- Unified memory between CPU and GPU
- Up to 5x higher AI performance per watt than CDNA2
- HBM memory
- Up to 8 silicon dies linked together
- MI300 accelerator taped out by Jun 2022, first si con in Q3
- APU design (combines GPU dies, core-logic and CPU CCDs into one package)
Intel Alchemist+ Architecture [updated]
- Release Date: 2023, probably H2 # #
- Seems to be canceled, considering it's 2024 and Intel is starting to talk about Battlemage #
- Refreshed "Alchemist" architecture #
- Could be on an improved node, better than TSMC 6 nm #
- Possibly higher core speeds with same core counts #
Intel Battlemage Architecture [updated]
- Release Date: 2024 or very early 2025 #
- Successor to "Alchemist" #
- New architecture #
- Newer foundry node and higher performance #
- Two variants: "Xe2 HPG" (high-performance) and "Xe2 LPG" (low-power) #
- Xe2 LPG will be first used in Meteor Lake IGP #
- Possibly only for desktop and workstation, no add-in cards for mobile #
- Xe core count doubled to 64, or 1024 EUs #
- Clocks up to 3 GHz #
- IPC improvements and new math formats #
- 256-bit memory, high mem clock #
- GPU codename: BMG-G10 # #
- Uses soldered BGA2362 #
- Two variants: BGA2362-BMG-X2 and BGA2727-BMG-X3 #
- PCI-Express 5.0 #
- Fabricated on TSMC 4 nm EUV process # #
Intel Celestial Architecture [updated]
- Release Date: H2 2026 #
- Confirmed "in development" as of Jan 2024 #
- Discrete GPU architecture
- Successor to "Battlemage" architecture
- Also called "Xe3 HPG"
- Fabricated on TSMC N3X (3 nm) # #
- Targets "Ultra Enthusiast" segment
- 8192 shaders, 2x that of A770 #
Intel Druid Architecture
- Release Date: Not before 2025
- Discrete GPU architecture
- Successor to "Celestial" architecture
- Also called "Xe Next HPG"
Chipsets
AMD X690E Chipset [added]
- Release Date: Probably 2024
- Could be some workstation-focused variant of the X670E chipset #
- Used on ASUS Pro WS X690E-SAGE SE #
AMD X870E Chipset [added]
- Release Date: 2024
- Supports Ryzen 9000 Granite Ridge with the Zen 5 architecture
- Same Socket AM5 as on Ryzen 7000
- USB4 40 Gbps support required, which makes this a 3-chip solution (2x Promontory 21 + 1x ASMedia ASM4242)
- Possibly support for DDR5-8000 EXPO
AMD X870 / B850 / B450 Chipsets [added]
- Release Date: 2024
- Supports Ryzen 9000 Granite Ridge with the Zen 5 architecture
- Same Socket AM5 as on Ryzen 7000
Intel 800-Series Chipsets
Memory
DDR6 System Memory
- Release Date: Unknown
- Four channels per module (2x that of DDR5, 4x that of DDR4)
- 64 banks
- Speeds starting at 12800 MT/s, up to 17,000 MT/s with OC
GDDR6+ Graphics Memory
- Release Date: Unknown
- Production: 2021
- Up to 24,000 MT/s
- Production process: 1z nm
GDDR6W Graphics Memory
- Release Date: Unknown
- Builds on Samsung's Fan-Out Wafer-Level Packaging (FOWLP) technology
- Mounts the silicon memory dies on a wafer instead of a PCB
- Up to 22 Gbps per pin
- With a 512 bit interface that would be 1.4 TB/s
- Up to 24,000 MT/s
- Could be renamed GDDR6+
GDDR7 Graphics Memory [updated]
- Release Date: H1 2024 #
- Speeds: 36,000 MT/s #
- First gen achieves 32 Gbps at 1.2 V, which is lower than the 1.35 V on GDDR6 #
- Over time up to 50,000 MT/s #
- Uses PAM3 signalling # #
- "Real-time error protection feature," maybe some kind of ECC? #
- Improved power efficiency #
- Will be used by NVIDIA GeForce 50 and AMD RDNA4
- Read clock can be configured to "always running," "disabled," "start with RCK start," "start with read" #
- 1ß production node #
- Samsung uses D1z node, 10-nm class with EUV #
- Samsung: 37 Gbps, 16 Gbit #
- Able to issue commands in parallel #
- Micron: 16 and 24 Gbit dies, up to 32 Gbps per pin #
- Hynix: 35.4 Gbps, 16 Gbit #
HBM3e Graphics Memory [updated]
- Release Date: H1 2024
- Same as HBM3 but with higher speeds #
- Samsung: up to 9.8 Gbps #
- Hynix # #
- Used on NVIDIA GH200
HBM4 Graphics Memory [updated]
- Sampling Date: 2025 #
- Mass production: 2026 # #
- Samsung: Non-conductive film (NCF) assembly and hybrid copper bonding (HCB) #
- 2048-bit interface #
- 6000 MT/s #
- Uses a copper layer as a conductor and oxide insulator instead of regular micro bumps #
- TSMC and Hynix have formed a joint venture to develop HBM4 #
Silicon Fabrication Tech
TSMC 4 nanometer+
- First tape outs: H2 2022
- Codename "N4P"
- 11% performance boost over N5, 6% over N4
- 22% better power vs N5
- 6% higher density than N5
TSMC 3 nanometer
- April 2020: on track
- Risk production: H2 2021
- Volume production: H2 2022 (confirmed as of Apr 2022)
- FinFET technology
- "FinFlex," offers standard cells with a 3-2 fin configuration for performance, 2-1 for power, 2-2 for balanced
- Uses TSMC's third implementation of EUV (Extreme Ultra Violet)
- Depending on FinFlex cell: 11%–33% speed improvement, 12%-30% power reduction, 0.64x to 0.85x area improvement
- 30,000 wafers per month at the start, 105,000 by 2023
- 12-inch wafer size
- SRAM scaling is difficult, structures not significantly smaller #
- Will also be produced in upcoming Arizona fab in 2026
- Intel has announced they have placed two orders for processors based on this process
- Seven customers as of Aug 2022 (Apple, AMD, Broadcom, Intel, MediaTek, NVIDIA and Qualcomm)
- TSMC N3E making good progress, now in 2023
- According to a newer report, both Samsung and TSMC are struggling with yields for their 3 nm node #
TSMC 3 nanometer+
- Release date: 2023
- First client will be Apple
TSMC 2 nanometer [updated]
- Release Date: 2023 (risk production)
- Volume production: 2025 #
- June 2020: TSMC is accelerating R&D
- Sep 2020: fab construction has begun
- Will use Gate-All-Around (GAA) technology
- Probable VVIP customer: Apple #
- Multi-bridge channel field effect transistor (MBCFET) architecture
- 10-15% speed improvement over N3 at same power, or 25-30% power at same speed
- Several process variants: N2, N2P and N2X
- Not using High-NA EUV #
- Nanosheet transistors
TSMC 1.4 nanometer
TSMC 1 nanometer
- Release Date: around 2030 #
- Fab construction: 2026 #
- Uses Semi-metal bismuth for contact electrodes #
- Chip plan planning has started as of Nov 2022 #
- Codename "A10" #
- Uses High-NA EUV #
Samsung 4 nanometer
Samsung 3 nanometer [updated]
- Mass Production: H12022
- "Initial production" started as of Jun 30th 2022
- Uses Gate All Around FET transistors (GAA), Multi-Bridge-Channel FET (MBCFET)
- 45% less power while delivering 23% more performance
- 35% less silicon space taken per transistor (vs. 7 nm)
- 16% less silicon space taken per transistor (vs. 5 nm)
- 2nd generation 3 nm expected in 2025, reduces power by 50%, improves perf by 30%, reduces area by 35%
- Samsung claims 60-70% yields as of May 2023 #
- In Jul 2023 Samsung claimed 60% yields, and points out that this is better than TSMC #
- According to a newer report, both Samsung and TSMC are struggling with yields for their 3 nm node #
- Trial run of second-generation 3 nm process starting in early 2024 #
Samsung 2 nanometer [updated]
- In early development as of Oct 2021, mass production in 2025
- Uses Multi-Bridge-Channel FET (MBCFETTM)
- Feb 2024: order received for AI chips #
- Efficiency improved by 25%, performance by 12%, area by 5% #
Samsung 1.4 nanometer
- In planning as of Oct 2022
- Mass Production: 2027
- GAA (gate-all-around)
- 2.5D/3D integration
- Micro-bumps
Intel 4 (7 nanometer)
- Release Date: 2023
- Uses EUV (Extreme Ultra Violet)
- 4x reduction in design rules
- Planned to be used on multiple products: CPU, GPU, AI, FPGA, 5G networking
- Used for Meteor Lake
- Twice the transistor count for the same area
- 20% perf/watt over 10 nm SuperFin ("Intel 7")
- 21% gain in frequency at 0.65 V, 10% at 0.84 V
- 40% lower power at 2.1 GHz
- Jan 2021: Intel reports "issues fixed"
- Jul 2021: Intel renames this process to "Intel 4"
Intel 3
- Release Date: 2023
- Uses EUV (Extreme Ultra Violet)
- Possibly still a 7 nanometer node, with improvements
- 18% perf/watt vs Intel 4
- Denser HP library
- more EUV
- Improve drive-current and via resistance
Intel 20A
- Release Date: H1 2024 #
- 20 Angstrom = 2 nanometer
- New transistors called RibbonFET
- PowerVia to connect silicon dies
- 15% perf/watt improvement over Intel 3 #
Intel 18A [updated]
- Release Date: 2025 #
- 18 Angstrom = 1.8 nanometer
- Intel expects to beat TSMC to this milestone #
- Improvements to RibbonFET for higher transistor density #
- 10% perf/watt improvement over Intel 20A #
- Feb 2024: an order for 18A has been placed by Faraday Technology Corp. for an Arm-based SOC #
Other
Toshiba/WD 5-Bit-per-Cell NAND Flash (PLC)
- Release Date: Delayed to 2025
- Stores an additional bit of information per cell (compared to QLC)
- 32 states per cell
- Will enable even cheaper SSDs, probably at a performance cost
Toshiba XL-Flash
- Developed by Toshiba
- Uses existing SLC flash technology to improve latencies
- 1/10th the read latency of TLC
- Good for random IOPS and better QoS at shallow queue depth
- Can combine SLC and TLC/QLC for tiered, cost-optimized storage
- Intel Optane memory competitor
- 128 gigabit (Gb) die (in a 2-die, 4-die, 8-die package)
- 4 KB page size for more efficient operating system reads and writes
- 16-plane architecture for more efficient parallelism
- Fast page read and program times
Kioxia / WD 218-layer 3D NAND Flash
- Release Date: 2023 #
- Sampling as of Mar 2023 #
- Uses CMOS directly Bonded to Array technology #
- 1 Tb TLC and QLC #
- Density increased by 50% #
- 3.2 GB/s #
- 20% improvement in write performance and read latency #
Hynix 238-layer 3D NAND Flash
- Release Date: 2023
- Mass production: Jun 2023 #
- 2.4 Gbps #
- 21% lower energy
- 20% higher speeds #
- 512 Gb samples shipping as of Aug 22
- 1 Tb in 2023
- 34% higher manufacturing efficiency #
- Will be used in PCIe 5.0 SSDs #
Hynix 321-layer 3D NAND Flash
- Release Date: H1 2025 #
- Transfer rate increased from 164 MB/s to 194 MB/s #
- 1 Tb capacity with TLC #
- 20 Gbit/mm² #
- 41% more bit growth, 13% shorter read latency, 12% faster program performance, 10% better read power efficiency #
- 16 KB page size, 4 planes #
- 2400 MT/s #
- Made from three stack of 107-layers each #
Samsung 300+-layer 3D NAND Flash
Samsung 280-layer 3D NAND QLC Flash [added]
Intel CXL Interconnect
- New interconnect for high-bandwidth devices like GPUs
- Targeted at enterprise and servers
- Competitor to NVLink, Infinity Fabric, and PCI-Express
- Uses PCIe physical layer
- Link layer designed for low latency
- 32 Gbps per lane, per direction (like PCIe Gen 5.0)
- Samsung has announced open-source Scalable Memory Development Kit (SMDK) in Oct 2021
PCI-Express 6.0
- Release Date: 2023
- Hardware expected: 2024
- Spec version 1.0 published as of Jan 2022
- Spec version 0.9 published as of Oct 2021
- Spec version 0.5 published as of Feb 2020
- Spec version 0.7 published as of Nov 2020
- 64 GT/s raw bit rate, up to 256 GB/s with x16
- Rambus has controller IP ready as of Jan 2022
- Rambus has PHY and controller ready as of Oct 2022
- Includes low-latency Forward Error Correction (FEC) with additional mechanisms to improve bandwidth efficiency
- Maintains backwards compatibility with all previous generations of PCIe technology
- New physical layer with PAM4 (pulse amplitude modulation) signaling replacing NRZ (non-return to zero)
PCI-Express 7.0
Apr 27th, 2024 02:19 EDT
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